Maximized Field-of-View with Ultra-Sharp Image Quality Slim Design Patent-Pending Crash Protection Intelligent Lens Mount Application Flexibility Seamless Integration with Velox Probe Station Control Software Autonomous Measurement Assistants Remote Operation See "Specifications & Details" tab for more information

High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz RF bandwidth to 500 MHz Long probe life: > 250,000 contacts Beryllium-copper tips for gold pads or tungsten for aluminum pads Oscillation-free testing of wide-bandwidth analog circuits Use with ACP series probes to provide functional at-speed testing for known-good-die Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

DC-40 GHz bandwidth 10 ps rise time Low insertion and return loss 2 mils of tip-to-tip compliance High probing angle and clearance

Enables wafer probing up to 100 A pulsed and 10A DC Innovative multi-fingertip design provides even distribution of current Supports up to 500 V Replaceable Tungsten probe tips Temperature range of -60°C to 300°C Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks Prevents against thermal runaway Measure devices on wafer at higher currents than ever before Small scrub minimizes damage to aluminum pad Small footprint – tip fits on a 1 mm pad

Coaxial and triaxial measurements up to 10,000 V High-quality construction with low-noise electrical performance Replaceable probe tips in a variety of tip sizes Temperature range of of -60°C to 300°C Triaxial measurement ensures a much better understanding of device leakage in the off state Highly reliable, stable and repeatable measurements Integrally designed as part of a complete measurement solution

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application

Lithographic thin-film construction Excellent crosstalk characteristics Non-oxidizing nickel alloy tips Innovative force delivery mechanism 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available GSG, SG, GS, GSGSG, GSSG, SGS configurations 50 to 250 µm pitches (other pitches available on request) High current version (2 A) available Advantages

Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical Reduced unwanted couplings and transmission modes Able to shrink pad geometries to 25 x 35 µm (best case) Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.