Optimized Measurement Setup Multi-purpose SIGMA instrument integration kit Shorter cabling and universal chuck connection Triax probe with protected guard Optimized signal path Safe probe tip exchange Seamless integration of various analyzers High Power Chuck Triax design for low-leakage measurements up to 3 kV Special chuck surface coating High-isolation ready High-current measurement up to 100 A with lowest contact resistance Optional upgrade for 10 kV (coax) operating voltage Thin wafer handling capability Safe Operation

SlimVue Microscope Combined eye-pieces and CCD camera mount 3x zoom and quick lens exchange Quick lens exchange 1 um optical resolution Minimized scope footprint Fast change from navigation optics to high-resolution optics Resolving ‹ 50 μm pads Simple integration with any mmW modules Application Specific Sigma Kits

Three Probe Technologies Infinity Probe: best for Al (Si) ACP Probe: best for AU (III-Vs) |Z| Probe: robust solution (long lifetime) Precision contact on a wide variety of materials from 26 GHz to 67 GHz Accurate results with excellent crosstalk Matching cables and substrates included Precise Contact Solution RF chuck ±3 μm surface planarity Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact Precision probe alignment Consistent contact force and overtravel Stable contact performance WinCal Calibration Software

Maximized Field-of-View with Ultra-Sharp Image Quality Slim Design Patent-Pending Crash Protection Intelligent Lens Mount Application Flexibility Seamless Integration with Velox Probe Station Control Software Autonomous Measurement Assistants Remote Operation See "Specifications & Details" tab for more information

High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz RF bandwidth to 500 MHz Long probe life: > 250,000 contacts Beryllium-copper tips for gold pads or tungsten for aluminum pads Oscillation-free testing of wide-bandwidth analog circuits Use with ACP series probes to provide functional at-speed testing for known-good-die Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

DC-40 GHz bandwidth 10 ps rise time Low insertion and return loss 2 mils of tip-to-tip compliance High probing angle and clearance

Enables wafer probing up to 100 A pulsed and 10A DC Innovative multi-fingertip design provides even distribution of current Supports up to 500 V Replaceable Tungsten probe tips Temperature range of -60°C to 300°C Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks Prevents against thermal runaway Measure devices on wafer at higher currents than ever before Small scrub minimizes damage to aluminum pad Small footprint – tip fits on a 1 mm pad

Coaxial and triaxial measurements up to 10,000 V High-quality construction with low-noise electrical performance Replaceable probe tips in a variety of tip sizes Temperature range of of -60°C to 300°C Triaxial measurement ensures a much better understanding of device leakage in the off state Highly reliable, stable and repeatable measurements Integrally designed as part of a complete measurement solution

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements