The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Provides an effectively noise free environment around the device under test (DUT)
• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Up to 4x faster flicker noise thermal testing on 30 μm pads
• Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
• Provides fully managed and filtered AC power to the entire system – prober and instruments
• Filters harmful noise generated by external thermal control systems
• Reduced “antenna effect” injection of unwanted RF noise into the measurement path
• Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• User-centered design minimizes training costs and enhances efficiency
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation

• Cryogen-free: cooling with two-stage pulse tube refrigerator (PTR)
• Low vibration
• Mechanical heat switch
• Internal charcoal sorption pump

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Re-configurable for DC, RF, mmW, FA, WLR and more
• Full thermal range of -60°C to +300°C
• Low-profile, straightforward design
• Spacious top chambers for up to 12 positioners
• Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
• Enables accurate low-noise measurements of atto amperes, femtofarads and microvolts at temperatures down to -60°C

• Die-to-die stepping time of under 100 ms
• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Even extreme variations in height, such as the case with warped wafers, can be compensated
• Interfaces to all major analysis instrumentation, optics software and testers
• Access to top side and bottom side of device under test (DUT)
• Highly accurate light measurement
• Test automation out-of-cassette for 24/7 operation