FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
More Product Information
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Revolutionary technology advancement for wafer and die-level photonics probing
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Real-time in-situ calibrations
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Highest accuracy in test results
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Lowest coupling loss
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Dark, shielded and frost-free
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-40°C to +125°C
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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IMX183 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-2050m) and color (1800 C-2050c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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IMX392 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-240m) and color (1800 C-240c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
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Quick and easy probe tip navigation
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Z drive can work in the same range as the chuck
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Enables higher separation gap while the DUT stays in focus
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Automatically configure and optimize performance
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24/7 operating
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Increased MTBF
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Protects the measurement setup
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Prevents involuntary mechanical contact between lens and probes
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IMX273 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-158m) and color (1800 C-158c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
-
Platform concept that enables the operation of different Alvium camera models with a common software
-
Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
-
Precise sensor-to-lens mount alignment
-
Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
-
Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000