FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
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More Product Information
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
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Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
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Reduced unwanted couplings and transmission modes
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Able to shrink pad geometries to 25 x 35 µm (best case)
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Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
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WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
See more Key Features on Specifications & Details tab
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Wafer temp verified <4.5 K (with 44 RF probes in contact)
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Magnetic field suppression to <200 nT
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Easy exchange of customizable probe cards
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Configurable for 150 mm, 200 mm and 300 mm wafers
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Options for fully automated wafer load or manual
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Complete software suite for manual, semi-auto, or fully automated probing
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25 wafer cassette capacity for fully automated testing
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~15 minute cooldown time per wafer
See more Key Features in Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
See more Key Features on Specifications & Details tab
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IMX183 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-2050m) and color (1800 C-2050c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
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AR0135CS CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1500 C-120m) and color (1500 C-120c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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