FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
Advantages
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
Document
More Product Information
- High-quality construction with low-noise electrical performance
- Kelvin version for convenient 4-point measurements
- Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
- SSMC 50 connectors
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
-
Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
-
Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
-
Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
-
Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
-
Utilizes ACP tip design, GSG, GS or SG
-
RF tips available from DC to 110 GHz
-
Choice of BeCu or tungsten tips
-
DC power needles come standard with 100 pF microwave capacitor
-
Power bypass inductance: 8 nH
-
Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
-
Ideal for probing the entire circuit for functional test
-
Dual ACP configuration supports differential signaling applications
-
DC probes can provide power or slow logic to circuit under test
-
PYTHON 480 CMOS sensor
-
ALVIUM image processing
-
MIPI CSI-2 interface
-
Various hardware options
-
Monochrome (1500 C-050m) and color (1500 C-050c) models
-
ALVIUM® Technology for on-board image processing
-
MIPI CSI-2 interface with up to 4 lanes
-
Platform concept that enables the operation of different Alvium camera models with a common software
-
Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
-
Precise sensor-to-lens mount alignment
-
Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
-
Industrial performance for embedded vision applications
-
Easy-to-install driver and code examples
-
IMX250 CMOS sensor
-
ALVIUM image processing
-
MIPI CSI-2 interface
-
Various hardware options
-
Monochrome (1800 C-508m) and color (1800 C-508c) models
-
ALVIUM® Technology for on-board image processing
-
MIPI CSI-2 interface with up to 4 lanes
-
Platform concept that enables the operation of different Alvium camera models with a common software
-
Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
-
Precise sensor-to-lens mount alignment
-
Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
-
Industrial performance for embedded vision applications
-
Easy-to-install driver and code examples
-
IMX392 CMOS sensor
-
ALVIUM image processing
-
MIPI CSI-2 interface
-
Various hardware options
-
Monochrome (1800 C-240m) and color (1800 C-240c) models
-
ALVIUM® Technology for on-board image processing
-
MIPI CSI-2 interface with up to 4 lanes
-
Platform concept that enables the operation of different Alvium camera models with a common software
-
Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
-
Precise sensor-to-lens mount alignment
-
Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
-
Industrial performance for embedded vision applications
-
Easy-to-install driver and code examples
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
