Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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Products
- High speed 60 kHz x3 (Color) or 120 kHz (Mono), and high resolution 28 μm or 900 dpi
- No missing or interpolated pixels
- Exposure control
- RGB colors (Color) or Mono/HDR mode
- Precalibrated pixel size for metrology applications
- Camera Link HS fibre interface
The FLIR Blackfly S Board Level variants are high performance, machine vision, area scan cameras designed for embedding into tight spaces. Unlike many board level cameras, it boasts a rich feature set applied to the latest CMOS sensors; the same feature set as the cased version. It is ready for integration with proven compatibility with popular SBCs and SOMs. The Blackfly S board level models enable OEMs to develop smaller, lighter, and lower cost solutions with embedded system connectivity and rich features.
The Blackfly S currently has a lead time of four weeks or less. Get the cameras you need – when you need them.
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. On-camera features including IEEE1588 clock synchronization and full compatibility with popular third-party software supporting GigE Vision, gives system designers the tools to quickly develop innovative solutions. GigE models featuring Lossless Compression (LLC) are also available with higher maximum frame rates and lower bandwidth requirements, helping maximize output without compromising image quality. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
The Blackfly S currently has a lead time of four weeks or less. Get the cameras you need – when you need them.
The BLAZE is the ideal camera for low-light spectroscopy detection, delivering extremely high sensitivity over the visible and NIR range. With low dark current and fast speed, the BLAZE offers a QE above 90% at 450 nm, 98% at 900 nm and 75% at 1000 nm
- Fully integrated smart vision system
- Mono and Color CCD sensor options
- Ultra small form factor 44 x 44 x 44 mm
- Industrial IP67 Housing
- Easy application setup via Laptop or PC
- M4 mounting holes on each surface
- Connects to standard vision lights
- Utilizes factory M12 style cordsets
- No software to install
- 100% Automatic Inspection
- Low cost of ownership allows you to distribute processing across the production line. More points of inspection = better failure analysis and faster, easier corrective actions.
- No Software to Install
- BOA Spot's embedded vision tools offer powerful, flexible inspection with a simple interface.
- Integrated lighting
- LED ring light with multiple available colors makes illumination easy.
- Flexible Mounting Options
- Thru- and surface-mounting options and a slim form factor let BOA Spot fit into tight spaces.
- High resolution global shutter CMOS sensor
- 3 resolution models – 2M, 3M and 5M
- Dual core 1.5 GHz processor
- Embedded application software
- Ease-to-use setup for new vision adopters
- Built-in vision capabilities for most applications
- Standard factory protocols (EthernetIP, Modbus, Profinet)
- Operator interface flexibility
- Gigabit Ethernet and RS232 communications
- Isolated I/O and direct lamp connections
- Integrated ring light (optional on 2M version only)
- IP67 enclosure with lens cap
- Convenient mounting options
- Standard M12 cables