Teledyne DALSA - Genie Nano-CXP Compact CoaXPress Cameras
- Uses standard PC Ethernet port & hardware
- Supports cable lengths up to 100 m (CAT-5e or CAT-6)
- Simplified set-up with field proven Sapera LT software featuring CamExpert
- Engineered to accommodate industrial environment with a ruggedized screw mount RJ-45 connector
Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading-edge high-resolution CMOS image sensors.
In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set — all at an incredible price.
Speed & Quality Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors. In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set—all at an incredible price.
Typical Applications Semiconductor wafer inspection Surface and bump inspection Electronics manufacturing 3D solder paste inspection Package and bump inspection Automated Optical Inspection (AOI) Solar panel inspection General machine vision And more!
Ultimate performance with Xtium-CXP PX8 Unleash the maximum from Genie Nano-CXP cameras with our Xtium™-CXP frame grabber. Supporting four input channels of up to 6.25 Gb/s, the Xtium-CXP takes full advantage of PCIe Gen 2.0 platform to deliver host transfer bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications.
Family Specifications
|
Camera Type |
Area Scan |
|---|---|
|
Sensor Technology |
CMOS |
|
Supported Interfaces |
CoaXPress |
|
Spectrum Capability |
Visible (400-700 nm), Near Infrared (700-1000 nm) |
|
Shutter Type |
Global Shutter |
Models
|
Model Number |
MP |
FPS |
Pixel Size (μm) |
Interface |
Spectrum |
|---|---|---|---|---|---|
|
16.7 |
120 |
4.5 |
CoaXPress |
Color |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Color |
|
|
37.7 |
43 |
2.5 |
CoaXPress |
Color |
|
|
67.1 |
30 |
2.5 |
CoaXPress |
Color |
|
|
16.7 |
120 |
4.5 |
CoaXPress |
Mono |
|
|
16.7 |
120 |
4.5 |
CoaXPress |
Mono, NIR |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Mono |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Mono, NIR |
|
|
37.7 |
43 |
2.5 |
CoaXPress |
Mono |
|
|
67.1 |
30 |
2.5 |
CoaXPress |
Mono |
More Product Information
Fully Integrated: With the ProBus™ interface, the AP033 becomes an integral part of the oscilloscope. The probe sensitivity and offset can be controlled from the oscilloscope front panel, the probe front panel, or by using remote control commands (GPIB or RS-232). Sensitivity, offset, input capacitance, and common mode voltage range are displayed on the oscilloscope screen. When used with a LeCroy digital oscilloscope, no external power supply is required.
- Image acquisition from Camera Link Base camera
- Supports Camera Link® operations up to 85MHz
- Supports 32/64-bit Windows platforms
- Quarter-length PCI Express x1 Board
- Power Over Camera Link® (PoCL) Compliant
- Offers external acquisition control signals on single PCIe x1 slotROHS compliant
- 5 GigE Ethernet port & hardware
- Supports cable lengths up to 100 m (CAT-5e, CAT-6) or (4T-6A)
- Simplified set-up with field proven Sapera LT software featuring CamExpert
- Engineered to accommodate industrial environment with a ruggedized screw mount RJ-45 connector
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. On-camera features including IEEE1588 clock synchronization and full compatibility with popular third-party software supporting GigE Vision, gives system designers the tools to quickly develop innovative solutions. GigE models featuring Lossless Compression (LLC) are also available with higher maximum frame rates and lower bandwidth requirements, helping maximize output without compromising image quality. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
The Blackfly S currently has a lead time of four weeks or less. Get the cameras you need – when you need them.
- Supports PCI Express Rev 2.0 x4 or higher, backwards compatible with PCIe Rev 1.10 slots
- Up to 512MB of high-speed image memory
- Single slot solution with reconfigurable camera control and general purpose input/outputs
- Available in 250 MHz and 350 MHz models
- 2, 4 and 8 channel modes
- 16-bit vertical resolution
- Max Sampling rate of 1.2 GS/s
- Max sinewave frequency of 250 MHz and 350 MHz respectively
- 4096 x 4096 sensor format
- 61.4 x 61.4 mm imaging area
- Read noise as low as 2.0 e- rms
- 18-bit digitization
- Up to 4 MHz readout (quad port)
- ArcTec™ technology for maximum deep cooling
-
HD4096 technology provides 12-bit resolution up to 8 GHz and 20 GS/s
-
Up to 5 Gpts of acquisition memory enables detailed viewing of long events
-
15.6" 1900 x 1080 Full HD capacitive touchscreen
-
New ProBus2 input supports up to 8 GHz bandwidth and direct compatibility with a wide variety of existing ProBus probes - 50Ω and 1MΩ coupling modes support all input types on a single connector
-
MAUI with OneTouch user interface for intuitive and efficient operation
-
Deep toolbox enables and simplifies complex analysis
-
Intuitive navigation to quickly find important features in long waveforms
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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