FormFactor - Cascade Chucks - Non-thermal and thermal chucks

  • Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
  • Temperatures range from -60°C to +300°C
  • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
  • Low Thermal Resistance Technology
  • MultiSense with multiple temperature sensors
  • Isolated from ground
  • Includes a jack for grounding and biasing
  • Advanced wafer vacuum system for warped/partial thin wafers
  • Provides uniform vacuum across the entire wafer surface
  • Advanced shielding technology
See more Key Featueres on Specfications & Details tab

Flexibility

  • Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
  • Temperatures range from -60°C to +300°C
  • Surfaces are nickel or gold-plated
  • Hybrid chuck design – operation with and without cooling unit
  • Field-upgradeable: On-site cold upgrades for all main prober platforms

Highest Efficiency for Reduced Cost of Test

  • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
  • Up to 15% faster transition times than other systems on the market

Low Thermal Resistance

  • Low Thermal Resistance Technology
  • MultiSense with multiple temperature sensors
  • Best temperature accuracy and uniformity

Superior Electrical Performance

  • Isolated from ground
  • Includes a jack for grounding and biasing
  • Highly planar chuck surface for consistant contact force and overtravel

Patented MicroVac™ Technology

  • Advanced wafer vacuum system for warped/partial thin wafers
  • Provides uniform vacuum across the entire wafer surface
  • 495 micro-holes with 200 µm diameter patterned throughout the chuck
  • Five user selectable vacuum zones: even partial wafers that do not cover all the chuck vacuum holes are held down with uniform vacuum
  • Increased measurement accuracy with uniform device heat dissipation and ultra-low wafer contact resistance

Patented FemtoGuard™ Technology

  • Advanced shielding technology
  • Enables ultra-low noise, fully guarded measurements and controlled leakage
  • Low residual capacitance for repeatability and advanced measurement accuracy and speed

IntelligentDry Air Control

  • Active CDA
  •  purge control to reduce the dry air consumption

Auxiliary Chucks

  • Dedicated RF chucks come with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
  • Different materials available: Steel, Absorber, Ceramic

More Product Information

FormFactor, Inc.

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. 

We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.


Contact Details 

FormFactor, Inc. Corporate Headquarters

7005 Southfront Road, Livermore, CA 94551, USA

Phone: 925-290-4000 

Contact form

Test & Measurement

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FormFactor - Cascade Chucks - Non-thermal and thermal chucks
FormFactor - Cascade Chucks - Non-thermal and thermal chucks
FormFactor - Cascade Chucks - Non-thermal and thermal chucks
FormFactor - Cascade Chucks - Non-thermal and thermal chucks