FormFactor - Cascade Chucks - Non-thermal and thermal chucks
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
See more Key Featueres on Specfications & Details tab
Chucks and Thermal Systems
All FormFactor wafer probe stations are fully integrated with an exclusively developed non-thermal chuck or a highly-reliable thermal chuck system from ATT. Depending on your application, temperature range and performance requirements we offer a large variety of thermal systems from -60°C to 300°C, ranging from the most powerful and fastest high-performance systems in the market to extremely economic systems providing the best cost-performance ratio you can get.
All our systems are nickel or gold-plated and guarantee superior electrical performance. Our patented MicroVac™ and FemtoGuard™ technologies provide advanced measurement accuracy and ultra-low wafer contact resistance, even for warped/thin wafers.
The modular concept for convenient and cost effective system upgrades provides highest safety of investment and easy customization.
Full Thermal Range Systems (-60°C to 300°C)
- Most powerful and fastest high-performance systems for highly demanding requirements
- Shortest transition times in the market
- Optional ECO Mode for lower air consumption (CDA) than other systems in the market (365l/min)
Economic Thermal System (-40C° to 300°C)
- 25% lower air consumption (CDA) than other systems in the market (300l/min)
- Power Mode: 15% faster transition times than other systems in the market
- Best cost-performance ratio of systems with a wide thermal range
Hot-Only Systems (+20°C/+30°C to 300°C)
- Modular and field-upgradeable to cold (-40°C or -60°C): grows with your needs
- Controlled Ambient Technology (+20°C): Precise temperature control, even below ambient temperatures, with no need of an additional chiller
Besides our technology-leading coaxial and triaxial chuck systems, our portfolio is complemented with the following specialized chucks:
- RF/microwave chucks, equipped with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- High-power chucks with Taiko wafer handling capability, an anti-arcing solution and an auto-discharging system for high throughput and measurement accuracy, while providing a regulatory-certified safe testing environment
- Double Side Chucks: Patented double side design can be configured to hold a variety of different substrate designs and sizes. Mainly used within emission microscopy systems, it can also be used to hold special substrates including MEMS dies held in square metal carriers.
*Chuck performance is specified in probe station Data Sheets.
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Low Thermal Resistance
- Low Thermal Resistance Technology
- MultiSense with multiple temperature sensors
- Best temperature accuracy and uniformity
Superior Electrical Performance
- Isolated from ground
- Includes a jack for grounding and biasing
- Highly planar chuck surface for consistant contact force and overtravel
Patented MicroVac™ Technology
- Advanced wafer vacuum system for warped/partial thin wafers
- Provides uniform vacuum across the entire wafer surface
- 495 micro-holes with 200 µm diameter patterned throughout the chuck
- Five user selectable vacuum zones: even partial wafers that do not cover all the chuck vacuum holes are held down with uniform vacuum
- Increased measurement accuracy with uniform device heat dissipation and ultra-low wafer contact resistance
Patented FemtoGuard™ Technology
- Advanced shielding technology
- Enables ultra-low noise, fully guarded measurements and controlled leakage
- Low residual capacitance for repeatability and advanced measurement accuracy and speed
IntelligentDry Air Control
- Active CDA
- purge control to reduce the dry air consumption
Auxiliary Chucks
- Dedicated RF chucks come with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- Different materials available: Steel, Absorber, Ceramic
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More Product Information
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Full thermal range of -60°C to +300°C
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Low-profile, straightforward design
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Spacious top chambers for up to 12 positioners
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Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
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Enables accurate low-noise measurements of atto amperes, femtofarads and microvolts at temperatures down to -60°C
See more Key Features on Specifications & Details tab
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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