FormFactor - Cascade Chucks - Non-thermal and thermal chucks
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Chucks and Thermal Systems
All FormFactor wafer probe stations are fully integrated with an exclusively developed non-thermal chuck or a highly-reliable thermal chuck system from ATT. Depending on your application, temperature range and performance requirements we offer a large variety of thermal systems from -60°C to 300°C, ranging from the most powerful and fastest high-performance systems in the market to extremely economic systems providing the best cost-performance ratio you can get.
All our systems are nickel or gold-plated and guarantee superior electrical performance. Our patented MicroVac™ and FemtoGuard™ technologies provide advanced measurement accuracy and ultra-low wafer contact resistance, even for warped/thin wafers.
The modular concept for convenient and cost effective system upgrades provides highest safety of investment and easy customization.
Full Thermal Range Systems (-60°C to 300°C)
- Most powerful and fastest high-performance systems for highly demanding requirements Shortest transition times in the market Optional ECO Mode for lower air consumption (CDA) than other systems in the market (365l/min)
Economic Thermal System (-40C° to 300°C)
- 25% lower air consumption (CDA) than other systems in the market (300l/min) Power Mode: 15% faster transition times than other systems in the market Best cost-performance ratio of systems with a wide thermal range
Hot-Only Systems (+20°C/+30°C to 300°C)
- Modular and field-upgradeable to cold (-40°C or -60°C): grows with your needs Controlled Ambient Technology (+20°C): Precise temperature control, even below ambient temperatures, with no need of an additional chiller
Besides our technology-leading coaxial and triaxial chuck systems, our portfolio is complemented with the following specialized chucks:
- RF/microwave chucks, equipped with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- High-power chucks with Taiko wafer handling capability, an anti-arcing solution and an auto-discharging system for high throughput and measurement accuracy, while providing a regulatory-certified safe testing environment
- Double Side Chucks: Patented double side design can be configured to hold a variety of different substrate designs and sizes. Mainly used within emission microscopy systems, it can also be used to hold special substrates including MEMS dies held in square metal carriers.
*Chuck performance is specified in probe station Data Sheets.
Low Thermal Resistance
- Low Thermal Resistance Technology
- MultiSense with multiple temperature sensors
- Best temperature accuracy and uniformity
Superior Electrical Performance
- Isolated from ground
- Includes a jack for grounding and biasing
- Highly planar chuck surface for consistant contact force and overtravel
Patented MicroVac™ Technology
- Advanced wafer vacuum system for warped/partial thin wafers
- Provides uniform vacuum across the entire wafer surface
- 495 micro-holes with 200 µm diameter patterned throughout the chuck
- Five user selectable vacuum zones: even partial wafers that do not cover all the chuck vacuum holes are held down with uniform vacuum
- Increased measurement accuracy with uniform device heat dissipation and ultra-low wafer contact resistance
Patented FemtoGuard™ Technology
- Advanced shielding technology
- Enables ultra-low noise, fully guarded measurements and controlled leakage
- Low residual capacitance for repeatability and advanced measurement accuracy and speed
IntelligentDry Air Control
- Active CDA purge control to reduce the dry air consumption
Auxiliary Chucks
- Dedicated RF chucks come with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- Different materials available: Steel, Absorber, Ceramic
More Product Information
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
- Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
- Application flexibility, ideal for use in high frequency applications
- Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
- Suitable for integration with vibration isolating tables
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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