FormFactor - Cascade Eye-Pass Probe - Durable multi-contact wafer probe with controlled impedance power bypass technology
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
The multi-contact Eye-Pass probe provides controlled impedance power connections enabling functional testing of even the most challenging circuits on-wafer. The high-durability composite multi-finger tip provides high compliance and ensures precise alignment. This custom probe allows the user to select the footprint pattern best suited for the application, with up to 12 contacts per probe head. Available contact types are ground, logic, standard and Eye-Pass power supply, power supply sense, and ac signal.
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More Product Information
The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.
The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.
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Cryogen-free: cooling with two-stage pulse tube refrigerator (PTR)
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Low vibration
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Mechanical heat switch
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Internal charcoal sorption pump
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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Fast GigE Vision InGaAs SWIR camera
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VGA resolution
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TECless
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Power over Ethernet
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Compact industrial design, no fan
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Up to 301 fps at full resolution
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GigE Vision interface with Power over Ethernet
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Comprehensive I/O control options
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Automated image correction
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Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
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Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
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LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
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Automatic load inductance compensation function ensures the most repeatable calibrations
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Easy to use Probe to ISS/CSR matching tool
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Additional remoting methods
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Interface with Velox™ over LAN
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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