FormFactor - Cascade Eye-Pass Probe - Durable multi-contact wafer probe with controlled impedance power bypass technology
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
The multi-contact Eye-Pass probe provides controlled impedance power connections enabling functional testing of even the most challenging circuits on-wafer. The high-durability composite multi-finger tip provides high compliance and ensures precise alignment. This custom probe allows the user to select the footprint pattern best suited for the application, with up to 12 contacts per probe head. Available contact types are ground, logic, standard and Eye-Pass power supply, power supply sense, and ac signal.
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Use our online tool to capture your design requirements and receive a quote.
More Product Information
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Full thermal range of -60°C to +300°C
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Low-profile, straightforward design
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Spacious top chambers for up to 12 positioners
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Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
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Enables accurate low-noise measurements of atto amperes, femtofarads and microvolts at temperatures down to -60°C
See more Key Features on Specifications & Details tab
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
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Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
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Re-configurable and upgradable as requirements grow
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Minimizes setup times with no loss in performance or accuracy
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Seamless integration of various measurement instruments
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Solid station frame
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Built-in vibration-isolation solution for superior vibration attenuation
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Rigid microscope bridge
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Compact and rigid mechanical design
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Highly accurate measurement results
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Incorporates best-known methods
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Ergonomic and straightforward design for comfortable and easy operation
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Low-profile design
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Simple microscope operation
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Quick and ergonomic change of DUT through pull-out stage
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Minimize training efforts
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Fast time to data
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Convenient operation
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Fastest Camera Link InGaAs SWIR camera
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VGA resolution
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TECless
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Compact industrial design, no fan
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Simple camera configuration via GenCP
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Compact industrial design
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Up to 301 fps at full resolution
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Simple camera configuration via GenCP
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Comprehensive I/O control options
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Automated on-board image correction
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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