FormFactor - HPD Model HE-3-SSV - Wet Helium-3 Cryostat
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
The Model HE-3-SSV insert is designed for standard sample loading with the sample in vacuum. The sample is typically attached at the bottom of the He-3 pot inside the inner vacuum chamber (IVC) for cooling. The system design minimizes the intrinsic heat leak to the He-3 pot and optimizes the performance, resulting in a cost effective He-3 cryostat that is extremely reliable and easy to operate. The Model HE-3-SSV is designed to be compatible with all kinds of superconducting magnets, such as solenoid, vector magnets, and more.
The He-3 insert can be operated with the 1 K pot pump turned off after it reaches the base temperature. In this case, the system will be extremely quiet, which is highly desirable for many applications. This unique feature also reduces the liquid helium consumption and makes the operation more cost effective.
This He-3 insert includes the following components:
- Charcoal sorption pump with heater and thermometer
- 1 K pot with thermometer
- He-3 pot with heater and thermometer
- Permanently stored He-3 gas
- IVC can
- Operation test
More Product Information
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
- Tackle demanding imaging applications using an eighth-generation Intel Core processor
- Capture directly from GigE Vision® and USB3 Vision® cameras
- Broaden support for Camera Link® , CoaXPress® , DisplayPort, HDMI, and SDI video interfaces using Zebra frame grabbers
- Customize I/O capabilities through four PCIe slots accepting full-height, half-length cards
- Install in space-limited industrial environments given its small footprint and rugged design
- Streamline application development using the Aurora Design Assistant flowchart-based IDE or the Aurora Imaging Library SDK
- Tackle machine vision applications with utmost confidence using field-proven tools for analyzing, locating, classifying, measuring, reading, and verifying
- Leverage machine learning including deep learning to categorize image content
- Ready for deep learning training with suitably equipped and configured model
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
See more Key Features on Specifications & Details tab
- High signal fidelity to 4 GHz bandwidth
- Low circuit loading – High input impedance and low capacitance
- 4 GHz, 2.5 GHz, 1.5 GHz and 1 GHz models
- 1 MΩ input resistance
- 0.6 pF (4 GHz) and 0.9 pF input capacitance
- ± 8 V input dynamic range, ± 12 V offset range
- Wide variety of tips and grounds
- Easy to use, integrated with oscilloscope
The Focus Compact Model (FCM) utility is a streamlined software package designed to be used with Focus’ AURIGA high-end Pulsed-IV system, that is used to generate Compact Models for transistors from their Pulsed-IV and wideband pulsed s-parameter data.
This is achieved by generating a network of lumped circuit elements that represent accurately the fundamental linear & non-linear behavior of the device over a broad range of bias and power range.
The result of the modeling is a netlist and compatible with- the most common CAD tools used in RF Design; such as AWR Microwave office (MWO) and Keysight PathWave Advanced Design System (ADS).
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IMX304 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-1236m) and color (1800 C-1236c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Sony ICX274 CCD sensor
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25 fps at full resolution
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Rugged housing
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Video-type auto iris
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Monochrome (GC1600H) and color (GC1600CH) models
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GigE Vision interface
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-5e or CAT-6)
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads or optional tripod adapterr
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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