Cryogenic Temperatures

• Fully isolated experiment space for true 4K temperatures during probing
• Cryogenic positioners to provide large travel ranges without warming up the device
• Integrated helium pot for high temperature stability of the device under test
• Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
• Rapid cool liquid nitrogen option for faster cool down times

See "Specifications & Details" tab for more key features

Environmental Control

• Wafer temp verified <4.5 K (with 44 RF probes in contact) 
• Magnetic field suppression to <200 nT​
• Highly uniform wafer temperature
• Precise thermal stability and control
• Solid construction with granite base enables precision motion and vibration control

See "Specifications & Details" tab for more key features

• Tests and validates performance directly on silicon without post-dicing packaging
• Dramatically reduces time to data and shortens development cycles
• Enables high scalability for high volume manufacturing
• Offers flexibility in chip design with full grid probing