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FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity.
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- Maximized Field-of-View with Ultra-Sharp Image Quality
- Slim Design
- Patent-Pending Crash Protection
- Intelligent Lens Mount
- Application Flexibility
- Seamless Integration with Velox Probe Station Control Software
- Autonomous Measurement Assistants
- Remote Operation
See "Specifications & Details" tab for more information
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
- 1 µm repeatable separation stroke
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features
Flexibility
- Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
- Re-configurable and upgradable as requirements grow
- Minimizes setup times with no loss in performance or accuracy
- Seamless integration of various measurement instruments
Stability
- Solid station frame
- Built-in vibration-isolation solution for superior vibration attenuation
- Rigid microscope bridge
- Compact and rigid mechanical design
- Highly accurate measurement results
- Incorporates best-known methods
Ease of Use
- Ergonomic and straightforward design for comfortable and easy operation
- Low-profile design
- Simple microscope operation
- Quick and ergonomic change of DUT through pull-out stage
- Minimize training efforts
- Fast time to data
- Convenient operation
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
Flexibility
- DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
- Full thermal range of -60°C to +300°C
- Compatible with TopHat or IceShield
- Usage of manual and motorized positioners, probe cards within EMI-shielded environment
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
High accuracy and repeatability
- Reliable and repeatable contact
- Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
- Advanced EMI-shielding with PureLine and AttoGuard technologies available
- Superior low-leakage and low-noise measurements
- Safe and accurate hands-off testing
- Minimizes settling times for efficient measurements over full thermal range
See "Specifications & Details" tab for more key features
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
