Measurement Accuracy

• Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
• Minimize AC and spectral noise with effective shielding capability
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection

See "Specifications & Details" tab for more key features

• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

Superior Mechanics

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
• 1 µm repeatable separation stroke
• Excellent measurement accuracy and repeatability
• Fast navigation and high-precision probe positioning

See "Specifications & Details" tab for more key features

• Accommodates a combination of up to four Cascade Microtech probes
• Configurable for mixed-signal RF/mmW testing
• Quick and easy repairs to be performed in the field, by simply replacing individual probes
• Adaptable to new device layouts by exchanging individual probes

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

Environmental Control

• Wafer temp verified <4.5 K (with 44 RF probes in contact) 
• Magnetic field suppression to <200 nT​
• Highly uniform wafer temperature
• Precise thermal stability and control
• Solid construction with granite base enables precision motion and vibration control

See "Specifications & Details" tab for more key features

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement