FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
The HPD PQ500, an innovative, high-density RF and DC socket interface for FormFactor’s HPD cryostats, enables developers to test chips without days-long delays for wire bonding and packaging, providing faster time to data. The new test system, the first commercial product of its kind, allows scientists to easily probe DUT pads at temperatures lower than 50 mK, providing the means for earlier and simpler characterization of device features in superconducting or silicon spin qubits, and other devices tested at cryogenic temperatures.
As the quantum industry matures and scales up the number of qubits for commercialization, accelerating test setup and ease-of-use becomes a priority. The PQ500 simplifies the test process for singulated die to accelerate test setup.
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Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
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Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
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Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
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Durable probe structure ensures more than 250,000 contacts
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Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
FormFactor's FRT Metrology engineers designed SurfaceSens technology to achieve superior information about the measured sample and greater insights about product quality. All of our FRT MicroProf® metrology tools can be configured with complementary sensor technologies. In a hybrid analysis process, otherwise inaccessible surface data of wafers or other samples are precisely measured.
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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