FormFactor - Cascade MPS150 Modular Probe Station
More Product Information
Impedance Standard Substrates (ISSs) supports all of your high-frequency probing applications. Using them ensures greater accuracy and better repeatability in on-wafer calibration of vector network analyzers. Our ISSs offer the proven accuracy of LRRM calibrations with automatic load inductance compensation.
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
-
Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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