FormFactor - Cascade MPS150 Modular Probe Station
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Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
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Re-configurable and upgradable as requirements grow
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Minimizes setup times with no loss in performance or accuracy
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Seamless integration of various measurement instruments
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Solid station frame
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Built-in vibration-isolation solution for superior vibration attenuation
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Rigid microscope bridge
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Compact and rigid mechanical design
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Highly accurate measurement results
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Incorporates best-known methods
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Ergonomic and straightforward design for comfortable and easy operation
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Low-profile design
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Simple microscope operation
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Quick and ergonomic change of DUT through pull-out stage
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Minimize training efforts
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Fast time to data
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Convenient operation
FormFactor introduces a new modular concept for its best-in-class 150 mm probe stations. This will make it even easier to configure your individual probe solution for current and future needs at an incredible price. Simply choose a base station and add as many application-specific starter kits as you need.
Available Options
Microscope
- Stereo Zoom Microscope
- High Resolution Microscope
Application Starter Kit (incl. Probes)
- IV/CV
- RF Basic
- mmW Basic
- Keysight N5291 (Advanced mmW)
- VDI Mini Extenders (Advanced mmW)
- Focus Microwaves Delta Tuners (Advanced Load-pull)
- Advanced THz
- Failure Analyis
- High Power
Positioner Kit
- Basic
- Advanced mmW / THz / Load-pull
Chuck
- Coax
- Triax
- RF
- Thermal
- High Power
Base Station
- Basic
- Advanced mmW / THz / Load-pull
More Product Information


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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die

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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays

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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy

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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface

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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer

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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements

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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
