FormFactor - Cascade PAV200 - 200 mm semi-automated vacuum probe system
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
Semi-automated wafer probing in a high vacuum environment
The PAV200 is a highly-precise semi-automated probe station for wafers and substrates up to 200 mm in a vacuum environment down to < 1×10-4 mbar. Designed for industrial environments and major research facilities, it supports a wide range of applications, including DC and RF measurements, MEMS and optoelectronic tests.
The PAV200 supports multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
Stability
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for demanding MEMS analysis
Ease of use
- Joystick controller
- Manual probe positioners with rotary feed-throughs
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
High measurement throughput
- Software control of chuck for fast step-and-repeat testing of the entire wafer
- Fast step-and-repeat testing of the whole wafer
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Thermal range: -60˚C to 300˚C available
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Upgrade path to meet your future needs
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Stable and repeatable measurements over a wide thermal range
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Advanced EMI-shielding with PureLine with AttoGuard technologies
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Best solution for low-noise and 1/f measurements
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Minimize AC and spectral noise
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Minimizes settling times for efficient measurements, without compromising accuracy over full thermal range
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Locking roll-out stage
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Innovative microscope remote control
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Intuitive ergonomic stage controls
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Quick, safe, and comfortable wafer access
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Easy on-wafer navigation
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Fast setup and test data gathering
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Dedicated Velox version for manual probe stations
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AugmentedAlign tool with on screen markers for improved RF measurement accuracy
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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Continues the Infinity family’s Industry leading electrical performance
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High temperature capability (175° C +) for automotive device characterization and other applications
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Better tip visibility for enhanced placement accuracy and repeatability
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Improved tip life/durability with solid rhodium contacts
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New tip architecture enables support for narrower pitches (e.g. 25um)
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Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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