FormFactor - Cascade Custom Probe Systems - Comprehensive technical and application know-how for challenging applications
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
For more information please contact your local sales representative.
Customization Examples
Waveguide with customized bracket
300 mm chuck with large tweezer pocket
RF positioner with micrometer screws
Double-side setup for emission microscopy
Combined microscope movement for scope and black body
mmW setup with North/South positioner platform
More Product Information
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Supports link widths up to 16-lanes
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Operates up to 16GTps, PCIe 4.0 data rates
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Downward compatible with PCIe 1.0, 2.0 and 3.0 data rates of 2.5, 5.0 and 8.0GTps
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A top edge 16-lane CEM slot connector accepts all endpoint DUT adapter cards
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Bottom edge 16-lane PCB finger connector installs into host test system’s 16-lane PCIe slot
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Data path uses high-speed linear redrivers to ensure good signal capture with minimal tuning
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Supports Analyzer side-band signal triggering and capture via custom cable
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Supports error injection for deep system analysis
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Interposer power is independent of host system. A 120/220 AC in, 12V/3A DC out converter is included
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Custom, exchangeable brackets enable secure chassis and endpoint card installations
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LEDs give quick indication of power and operation
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Format: Design is based on the 16-lane Card Electro-Mechanical (CEM) specification
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Size: 230mm deep x 185mm tall x 15mm thick
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Supported by Xgig tool suite including Trace Control, Expert and Serialytics
Total power subsystem integration
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Total power subsystem integration
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Power sequencing
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Elapsed time indication
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EMO function
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Custom rear output panel
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Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
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Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
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Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
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Durable probe structure ensures more than 250,000 contacts
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Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
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Revolutionary technology advancement for wafer and die-level photonics probing
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Real-time in-situ calibrations
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Highest accuracy in test results
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Lowest coupling loss
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Dark, shielded and frost-free
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-40°C to +125°C
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
See more Key Features on Specifications & Details tab
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Operates up to 16GTps, PCIe gen-4 data rates
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Downward compatible with PCIe gen-1, gen-2 and gen-3 data rates of 2.5, 5.0 and 8.0GTps
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SFF-8674 host and target connections support PCIe links of up to 4-lanes
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Multiple Interposers can be used with links to 16-lanes.
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Supplied with two high-quality SFF-8674 equivalent custom cables for Analyzer plus two cables for DUT attachment
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Data path uses high-speed linear redrivers to ensure good signal capture with minimal tuning
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Supports Analyzer side-band signal capture and triggering in multiple formats
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Two coax cables supplied for optional clocking sources
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Interposer power is independent of host system.
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A 120/220 AC in, 12V/3A DC output converter is included
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LEDs give quick indication of power and status
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Size: (L x W x H): 112 x 150 x 30 mm (incl. rubber stands)
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Works together with VIAVI Xgig 4K Analyzer platforms
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Provides consistent, repeatable capture of link training, equalization negotiation and other data traffic
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Supports error injection for deep system analysis
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Supported by Xgig tool suite including Trace Control, Expert™ and Serialytics™
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
See more Key Features on Specifications & Details tab
The SSIEC3V3M System is designed to develop a 1.5 x 1.5 meter uniform field area (UFA) of up to 5.4 V/m CW up to a 3m test distance for IEC 61000-4-3 testing from 80MHz-6GHz. The signal generation, control, and power monitoring equipment shall be mounted in a ventilated equipment rack along with the RF amplifiers.
The SSIEC3V3M AR System consists of the AR equipment, listed herein. Please refer to individual product specification sheets for details. The export classification for this equipment is EAR99. This equipment is controlled for export in accordance with the U.S. Export Administration Regulations. Diversion contrary to U.S. law is prohibited.
AR Standardized Systems are customizable upon request. Contact AR for all such requests.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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