Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

PureLine 3 Technology

• Provides an effectively noise free environment around the device under test (DUT)
• First automated probe station to achieve -190dB spectral noise*
• Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
• Eliminates over 97% of the environmental noise experienced in previous probe systems
• Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP

Plug In and Go

• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Eliminates all ground-loop induced TestCell noise
• Low field emissions
• Provides fully managed and filtered AC power to the entire system, prober and instruments

See "Specifications & Details" tab for more key features

Small form factor rugged mini PCs designed in secure, compact enclosures to enhance performance and adaptability alongside evolving workloads. ION Mini PCs are designed to enhance performance, scalability, and security for the most complex application and program demands.

• Harsh-environment Protection - All key components are stress-tested to pass stringent military standards, ensuring stability in harsh environments.
• Server-class Features - A Mini PC powerhouse with server-class specs like IPMI for remote management and virtualization for increased flexibility and scalability.
• Full Control & Customization - Our in-house software engineers can tweak BIOS source code to bolster firmware security and meet your exact needs.

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

Resistance decade box designed for RTD and other resistance-based sensors' simulation. 0.1°C accuracy and 5W load capacity.

• Real resistors switched by relays
• Custom temperature scales
• No residual resistance
• 5 W load capacity
• Six different languages

• Up to 20 GHz bandwidth and 80 GS/s sample rate
• The most advanced oscilloscope user interface
• The industry’s only true hardware 14.1 Gb/s serial trigger
• Low Jitter Measurement Floor and exceptional timebase stability
• Comprehensive set of serial data analysis, debug, validation and compliance tools
• Integrated 50 Ω and 1 MΩ inputs for true connection and probing flexibility
• Integrated standard and custom measurements and math functions for unrivaled analysis capability
• Multi-lane serial data eye, jitter and crosstalk analysis
• Real-time de-embedding, emulation, and equalization