• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

• Different substrate carriers for wafers up to 100 mm or single dies
• Up to six positioners
• Independently cooled cold shield
• Probe positioners placed inside vacuum chamber
• Ergonomic and straightforward design
• Simple microscope operation
• Independent control of linear chuck stage and positioners
• Contact/separation stroke for probe platen

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
• Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
• Sample size: Proven with chips up to 10×10 mm in size.
• Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.

• Revolutionary technology advancement for wafer and die-level photonics probing
• Highest accuracy in test results
• New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
• Minimized coupling losses with minimal trench dimensions
• Industry standard for vertical coupling to wafer-level grating couplers
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Dark, shielded and frost-free
• -40°C to +125°C
• Leveraging considerable expertise through an innovative engineering team
• Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
• Exclusive FormFactor-developed automated test methodology
• Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
• FormFactor-developed graphical user interface to manually control the optical positioning system
• Configurable between single fibers, fiber arrays and edge coupling holders

• Cryogen-free option available
• Flexible sample space
• Low noise, low vibration
• Long holding time
• Stable He-3 pot temperature

• Multi-purpose SIGMA instrument integration kit
• Shorter cabling and universal chuck connection
• Triax probe with protected guard
• Triax design for low-leakage measurements up to 3 kV
• Special chuck surface coating
• High-isolation ready
• Arcing protection
• Shield Enclosure with interlock
• Advanced grounding concept

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage