Floating Action Buttons

• Easy and fast setup of camera views
• Go to Light and Image Settings of the selected camera view with only one mouse click

Workflow Wizard

• Guided workflows for wafer setups, alignment tools and Autonomous Assistants
• Workflow wizard shows task-relevant settings and options only
• Wizard settings can be corrected anytime – no need to restart the wizard
• Wizard helps with intelligent solutions in case of error

See "Specifications & Details" tab for more key features

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements

More than a calibration tool

• Calibration
• Validation
• Measurement
• Analysis

No one supports more VNA’s

• Support of more than 24 of the most common VNA’s

Tool for the novice

• Guided wizards and multimedia tutorials integrated
• Intelligence in setups

See "Specifications & Details" tab for more key features

Gold-plated TESLA High-power MicroVac™ Chucks

• Prevent thin wafers from curling and breaking
• Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature

Flexibility

• Different substrate carriers for wafers up to 150 mm or single dies
• Up to six positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Probing with an open chamber lid possible under atmospheric condition
• Specially designed for laboratory environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.

• Accommodates a combination of up to four Cascade Microtech probes
• Configurable for mixed-signal RF/mmW testing
• Quick and easy repairs to be performed in the field, by simply replacing individual probes
• Adaptable to new device layouts by exchanging individual probes