FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
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Accommodates a combination of up to four Cascade Microtech probes
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Configurable for mixed-signal RF/mmW testing
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Quick and easy repairs to be performed in the field, by simply replacing individual probes
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Adaptable to new device layouts by exchanging individual probes
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Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
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Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
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Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
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Durable probe structure ensures more than 250,000 contacts
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Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
- Small
- Complete, closed-loop system with embedded controls in less than 28 x 13.2 x 7.5 mm
- Precise
- 0.5 µm resolution
- 6 mm of travel
- Simple system integration
- High-level motion commands over standard serial interface (I2C or SPI)
- Flexible system, fast to market
- Rapidly configurable for push or pull motion
- Low voltage / low power use
- 3.3 V input, <500 mW power use
- Holds position when power is off
IRIS optical ground stations are built to cater to a wide range of applications (LEO/GEO/Probes), including Earth observation, high throughput bi-directional telecommunications, feeder link, or deep space missions. The IRIS systems leverage the Cortex Lasercom, a globally recognized optical modem that supports various standards such as SDA, CCSDS, and HPE.
Configurable and SWaP-C optimized with maximum storage capacity, processing power, and intelligence, our ruggedized, TAA-compliant BAM servers are the perfect solutions to accelerate and sustain ever-evolving applications
- Leading Performance CPUs - Supports dual Intel® 3rd Gen Xeon® SP CPUs with hardware-based encryption for enhanced compute and networking.
- High-end GPUs and FPGAs - Supports multiple double-wide, high-end Intel® and NVIDIA® GPUs and FPGAs to accelerate AI/ML/DL workloads at the edge.
- Fast NVMe SSDs - Supports up to 8 high-speed NVMe or 9 SAS/SATA SSDs to increase read/write speeds (FIPS 140-2/3 available).
- High Power Density: Up to 15 kW in 3U, 30 kW in a 6U chassis
- Wide Voltage Range: 0-10V up to 0-1000V, from 4 to 30 kW
- Fast Load Transient Response: Protection from undesired voltage excursions
- Low Ripple and Noise
- Intuitive Touch Screen Display
- Parallelable up to 150 kW
- Sequencing: Free system controller & speed up test
- Low audible noise: Temperature controlled variable speed fans
- The LL167 Series provides a focused line of illumination in a passively cooled design.
- Only available in White (for color illumination in a similar package refer to our LL137 Series).
- Provides a high intensity level of 472kLux (working distance of 75mm).
- Available in pre-engineered sizes from 6” (152mm) to 96” (2438mm) in 6″ increments.
- A 3″ (75mm) length option is also available.
- Available intensity control provides illuminance adjustability for every 6″ increment via a 0 – 10v input
- Scale system performance from one to four computing clusters for demanding image acquisition and processing needs
- Support any camera interface type with the addition of appropriate Zebra frame grabber board(s)
- Exchange data between compute clusters internally at high speed through a PCIe Gen3 switched fabric backplane
- Maximize density in a 4U chassis with up to 10 full-length and one half-length, full-height PCIe Gen3 slots
- Tailor host data transfer bandwidth needs through PCIe x16, x8, and x4 interfaces
- Minimize the need for revalidation by utilizing a lifecycle-managed platform with consistent long-term availability
- Simplify system integration by using an integrated platform from a single vendor
- Solve applications rather than develop underlying tools by leveraging standard Microsoft® development tools and Aurora Imaging Library software
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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