FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
More Product Information
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Bias tees with a perfect balance of RF performance and DC power handling
Auriga’s Bias Tees balance impressive RF performance with heavy-duty power handling across multiple frequency bands ranging from 100 MHz to 67 GHz. They are designed for rigorous usage without sacrificing RF performance. Only the highest-quality materials are used to minimize signal loss and enable efficient heat removal.
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
A highly precise skew matching cable assembly with skew of 1psec or less between 2 cables, designed for digital transmission evaluation. Continuous operating temperature range: -30 to +85°C.
Exhibits low cable insertion loss and is suitable for high-precision differential signal transmission evaluation and measurement applications. 4 types of cables with different maximum usage frequencies (26.5GHz, 40GHz, 50GHz, and 67GHz) are available.
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Affordable Camera Link InGaAs SWIR camera
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QVGA resolution
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Compact industrial design, no fan
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Simple camera configuration via GenCP
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Compact industrial design
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Up to 344 fps at full resolution
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Camera Link interface with GenCP support
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Comprehensive I/O control options
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Automated on-board image correction
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Stabilized sensor cooling, no fan
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Extended operating temperature range
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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy
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- Available in 250 MHz and 350 MHz models
- 2, 4 and 8 channel modes
- 16-bit vertical resolution
- Max Sampling rate of 1.2 GS/s
- Max sinewave frequency of 250 MHz and 350 MHz respectively
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
Configurable and SWaP-C optimized with maximum storage capacity, processing power, and intelligence, our ruggedized, TAA-compliant BAM servers are the perfect solutions to accelerate and sustain ever-evolving applications
- Leading Performance CPUs - Supports dual Intel® 3rd Gen Xeon® SP CPUs with hardware-based encryption for enhanced compute and networking.
- High-end GPUs and FPGAs - Supports multiple double-wide, high-end Intel® and NVIDIA® GPUs and FPGAs to accelerate AI/ML/DL workloads at the edge.
- Fast NVMe SSDs - Supports up to 8 high-speed NVMe or 9 SAS/SATA SSDs to increase read/write speeds (FIPS 140-2/3 available).
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