FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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More Product Information
- High Power Density (2 VA/cubic inch)
- Single or multi-phase output
- Parallel operation
- 4.8 Crest factor
- Digital control loop technology
- ≥0.95 PFC
- Brown-out simulation
- AC 875 VA
- 45 to 5000 Hz
- Universal AC/DC input via mainframe
- User configurable
- Simple integration
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High SNR mode (up to 24 dB better signal-to-noise ratio)
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Low-noise binning mode
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Shading correction
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Defect pixel correction
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Area of interest (AOI), separate AOI for auto features
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Binning
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Decimation
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Auto gain (manual gain control: 0 to 24.4 dB)
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Auto exposure (31 µs to 67 s)
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Auto white balance
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Look-up table (LUT)
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Hue, saturation
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Color correction
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Local color anti-aliasing
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Reverse X/Y
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Deferred image transport
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Trigger programmable, level, single, bulk, programmable delay
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Sequence mode (changes the camera settings on the fly)
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SIS (secure image signature, time stamp for trigger, frame count etc.)
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Storable user sets
Scope of delivery
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Camera and IEEE 1394b cable (other configurations on request)
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
- High Power Density: Up to 15 kW in 3U, 30 kW in a 6U chassis
- Wide Voltage Range: 0-10V up to 0-1000V, from 4 to 30 kW
- Fast Load Transient Response: Protection from undesired voltage excursions
- Low Ripple and Noise
- Intuitive Touch Screen Display
- Parallelable up to 150 kW
- Sequencing: Free system controller & speed up test
- Low audible noise: Temperature controlled variable speed fans
Vimba is our future-proof platform-independent SDK for all Allied Vision cameras with GigE Vision, USB3 Vision, IEEE 1394, and Camera Link interface. With Vimba, you can acquire images and control your Allied Vision camera instantly, but also program complex vision applications or connect to third-party libraries.
Highlights
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
Our EuroBrite™ lineup outdoes the competition in so many ways. With more features at a competitive price point, there’s no better value in machine vision lighting:
- Complete built-in control for continuous and strobe modes.
- Adaptive Power™, a feature of the EuroBrite™ lighting controller, utilizes an onboard thermistor to maximize light output in continuous mode.
- Adaptive Overdrive,™ another feature of the EuroBrite™ lighting controller, provides a maximal output pulse in strobe mode regardless of the exposure period.
- IP67 sealed enclosure suitable for washdown environments.
- Rugged construction that has been tested to withstand over 1000lb.
- Industrial grade LEDs providing high-intensity surface illumination of 38klux.
The EMX-4xxx product family contains high-performance breakout boxes (EMX-4008 and EMX-4016), smart high density dynamic signal analyzers (EMX-4250 and EMX-4251), smart PXIe 625 KSA/s 4-channel digizers (EMX-4350), and charge and IEPE PXIe 625 KSA/s 4-channel digitizers (EMX-4380).
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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