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The RL127 is characterized as a Large High Dispersion Bright Field ring light.
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Non-lensed LEDs disperse light at broad angles, providing “soft” lighting for applications that require short to medium working distances.
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The low-profile design is only .75” (19mm) thick, with an O.D. of 4.6” (117mm) and I.D. of 2.61” (66.3mm) allowing it to be used in space constrained applications.
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The I.D. provides a standard 67mm diameter thread with a pitch of .75mm for further mounting flexibility.
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A wide variety of wavelengths are available from UV to IR. An optional polarizer and/or diffuser may be used to further condition the light output.
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The RL121 delivers 20kLux at a working distance of 100mm.
FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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96 digital lines configurable as either input or output
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Five available power supply rails for custom designs
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Mix and match with standard SMIP switching and digital I/O modules to create high density configurations
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VXIplug&play driver simplifies software development
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On-board connector header for simplifed migration to PCB implementation
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Access to 16 MHz clock for use in complex designs
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Multiple front panel connector options
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High-density, compact (1U) precision data acquisition instruments
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LXI™ LAN connectivity
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Fully integrated signal conditioning maximizes performance and accuracy
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Easily integrate thermocouples, voltages, RTDs, thermistors, frequency, strain and pressure on an per-channel basis
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Distributed, synchronized measurements over the wire
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Scalable architecture easily expands from tens to thousands of channels
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DC version available for test cells requiring closer proximity to test article
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End-to-end self-calibration ensures optimum runtime performance
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Web-based access for monitoring and control
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Exlab turnkey software for simplified setup, control and data display
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
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Allan deviation σ(τ) = 2.7×10-11 T-1/2 for long life version and σ(τ) = 8.5×10-12 T-1/2 for high performance version
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Front or Rear access connectors
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3U high (133mm / 5.24”) — less than 200mm depth, compatible with ETSI and 19” standards
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Accuracy better than ±1×10-12 / ±5×10-13 for high performance version
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10 MHz low noise direct output
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Programmable 1 / 5 / 10 MHz TTL output
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10 years warranty on cesium tube (3 years for high performance version)
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Redundant DC power supply inputs
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Remote control and monitoring via RS232 (fully manageable locally and remotely using SyncView Plus management system.
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
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High Intensity: up to 9x brighter than the existing SL191 Pattern Projecting Spot Light and more than 3x brighter than the leading competitive structured light projector.
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Projection patterns are easily configured with available reticles, including line, grid, cross, multiple lines, and half sphere, with custom reticles available.
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Customizable: available in multiple wavelengths, including white.
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Constructed with a large heat sink for improved LED thermal management to facilitate increased brightness while maintaining safe operating temperatures.
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Ideal solution for machine vision inspection applications requiring structured illumination, including edge detection, locating offsets, and assessing topography.
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will
continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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