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Part of the MicroBrite™ family of high performance, compact machine vision lights.
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The edge-lit design provides the highest flux density of any backlight in our portfolio.
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Ultra-thin profile for installations with demanding space limitations.
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Available in 3 sizes with a multitude of available wavelengths.
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Base Model numbers include BT050050, BT200100, BT100100
FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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- Part of the MicroBrite™ family of high performance, compact machine vision lights.
- This line light series utilizes a fresnel lens for a compact form factor.
- Provides an intensity level of 189kLux (working distance of 75mm)
- Expandable in 50mm increments up to 750mm
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
A highly scalable, compact, secure, rugged rack server with the latest high-performance computing technologies to ensure peak performance and adaptability for a variety of ever-changing applications.
- Maximum Configurability, Flexibility, and Scalability - Quickly adjust your system’s performance to meet the constantly fluctuating demands of diverse data environments and ensure operational efficiency.
- Enhanced Compute + Connectivity - Process, analyze, store, retrieve, and transfer large amounts of actionable intelligence in seconds to improve decision-making and reduce response times.
- Ruggedized for Extremes - Tested to meet the toughest military and industrial standards to ensure the quality and reliability of our solutions within harsh and austere conditions.
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
STAR (EWC15-NG) is a new generation of transceiver for high performance Telemetry, Tracking & Command (TT&C) services. It inherits from the EWC15 products, that have been used in key space missions such as ROSETTA, DEEP IMPACT, PARASOL, MICROSCOPE.
- Only BSDL files required to get the board up and running
- Set up pin states – e.g. low, high, toggling
- Trace shorts, opens and other signals
- Easy low-level access to device pins/busses
- Clear display of the pins/balls with variable zoom levels and split screen
- View JTAG chain data as waveforms
- Quickly find and monitor changing pins
- Program devices with SVF and STAPL files
- Real-time interaction
- XJIntegration (use XJAnalyser functionality from other software)
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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