FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
More Product Information
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- Part of the MicroBrite™ family of high performance, compact machine vision lights.
- Produces an intensity level of 41kLux (working distance of 180mm).
- Available in several sizes including 50mm, 100mm, 160mm and 200mm.
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- The Linear Coaxial Light provides a type of diffuse illumination; diffuse light from an internal source is folded downwards along the camera’s imaging axis and onto the imaging plane.
- High speed machine vision line scan applications receive greater image contrast with a Linear Coaxial Light.
- The DL110 includes a high efficiency, coated, easy to clean dust cover to protect the beamsplitter.
- The BL128 Series provides a compact linear backlight solution ideal for space-constrained line scan applications.
- Its ultra-thin profile (less than ½”) minimizes vertical footprint, and bezel-free design along the length allows for placement of its emitting window right up to adjacent surfaces.
- While optimized for line scan setups, the BL128’s versatility extends to general-purpose machine vision lighting as a non-directional, highly diffuse bar light illuminator when needed.
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- Combine up to 6 SPDT and 6 multiport high-performance building blocks in a 2U footprint
- Extended life and self-terminating options provide maximum design flexibility
- Embedded web interface provides interactive utility to monitor and control relays from anywhere in the world
- Flexible API supports IVI and Linux development environments minimizing software investment
- LXI Trigger Event implementation provides seamless test synchronization with external devices
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- Combine up to 12 fail-safe building blocks, dual SPDT, SP4T, SP6T, or transfer switch in a compact 1U footprint
- Front “pluggable” relays facilitate field maintenance
- Embedded web interface provides interactive utility to monitor and control relays from anywhere in the world
- Flexible API supports IVI and Linux development environments minimizing software investment
- LXI Trigger Event implementation provides seamless test synchronization with external devices
- Store up to 128 relay state configurations for quick recall, including an automatic power up state
- Define exclude lists to avoid setting an undesirable configuration
- Relay odometer tracks closures to facilitate preventative maintenance
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- Back-illuminated CCD sensors with >95% QE (over ~5 eV to 30 keV range)
- 2k x 2k and 4k x 4k formats; 13.5 and 15 micron pixels
- High frame rates with up to 4-port readout
- Cooling down to -90ºC using liquid or air
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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- Extended Spectral Range
- Capture images from visible light to SWIR (400 nm to 1700 nm) and enhance detection and analysis across various materials and applications.
- Compact and Balanced Design
- The compact housing balances image performance and size. It is ideal for space-constrained environments without compromising image quality.
- GigE Performance and Reliability
- GigE driver performance with the Spinnaker® SDK, Sapera™ Processing, and a powerful Trigger-to-Image Reliability (T2IR) framework.
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FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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