FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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More Product Information
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Complete Test Solutions
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Complete test solutions for emissions and immunity compliance testing of AC and DC powered products
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Single & Three Phase Operation
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Offers flexibility
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Direct PC Bus Access
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Provides high sampling rate and resolution for accurate measurements and high speed data transfers
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PC based harmonic & flicker testing
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provides real-time full color data display updates and continuous PASS/FAIL monitoring.
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Supports Global Standards
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Supports European and Japanese standards
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Easy To Use Interface
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Provides IEC test setup, data analysis, display, MS Word test reports, and data files are generated in MS Excel format
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High resolution
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Data storage to disk in for post-acquisition analysis and reporting
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Single Step
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Single Step and Fast Forward replay of recorded test data at 200 mSec
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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
Safran’s SEEING™ 130 Wide includes a unique medium focal length catadioptric optics, limited by diffraction only and with ultra-low distortion, offering perfect imaging over 35 mm full-frame image format. It is fitted with a 10megapixel sensor.
SEEING™ 130 Wide enables high Signal to Noise Ratio for multispectral (MS), hyperspectral (HS) and low light level imaging. SEEING™ 130 Wide includes a spectral filter with 23 bands covering Blue, Green, Red, Near InfraRed and Red Edge MS, for a broad spectral range between 475 and 900nm. SEEING™ 130 Wide has a large Field of View of 6.3° x 4.3° / 54 x 36 km2 from a 500km/310 miles orbit.
In addition to its a thermal design within a robust structure, SEEING™ 130 Wide has a low SWaP, saving launch and operational costs.
The D19-GT/-GTS Download Station ensures a secure and high-speed data download (via 40 Gbit Ethernet) from MDR or MDR-GT/-GTS storage media. Specifically designed for flight testing applications with demanding data rates and storage needs, the D19-GTS, when paired with MDR-GTS, incorporates advanced cybersecurity features like Data-At-Rest (DAR) protection and firmware updates. Configuration changes are facilitated through a Removable Secure Operational Disk (RSOD).
- High power density / low ripple and noise
- High programming resolution with Ethernet interface
- Constant voltage and current mode
- Remote sensing
- Isolated analog control and monitoring (optional)
- The Narrow Linear Diffuse Light series is ideal for precision scanning of highly reflective materials.
- The DL151 is available in a wide range of wavelengths and provides up to 28kLux at a 1” (25mm) standoff.
- The extruded aluminum enclosure can be expanded in 2″ (51mm) increments from 2″ to 70″ (1778mm).
With its small and high ruggedized design, XMA is the best fit for remote data acquisitions in harsh and small space areas.
It is the perfect candidate for network telemetry applications and remote acquisitions, to reduce the wire intrusiveness, and acquire the data closer to the sensors.
XMA also allows data recording, data processing, GPS localization and data transmission. XMA has the smallest size/channel types ratio, and proposes optimized module set for a large number of data type acquisitions, with state-of-the-art accuracy.
A complete set of status and health information of the unit is remotely available for live monitoring and accurate data qualifiers.
- High Power Density : 3 kW and 4 kW models, 2U (3½” high), (19” wide); no top or bottom clearance spacing required
- Preview Push-button : Overvoltage protection (OVP), voltage and current preview buttons
- Remote Voltage Sense : Sense leads are easily connected to a solderless connector
- Parallel or Series Operation Field configurable
- Power Factor Correction ≥0.98 1 Ф 3kW
- S-parameters DC to 40 GHz, single-ended and mixed-mode
- Impedance Profile with <1 mm resolution, differential and common-mode
- Internal, automatic OSLT calibration
- USB-connected, small, lightweight
- Flexible display of the measurements
- Remove effects from fixtures, connectors and cables
- Emulate eye diagrams with CTLE, DFE and FFE equalization
- Advanced jitter analysis
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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