FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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The NS1310 is a robust, compact data server and storage unit specifically designed for the challenging conditions of airborne environments.
This versatile system functions as a Network Attached Storage (NAS) unit and is equipped with a high-capacity Removable Memory Module (RMM).
The ENERTEC™ mission data processing and distribution units offer cost-effective and dependable solutions for field and mission data tasks, such as data acquisition, processing, storage, exploitation, and distribution. These units are suitable for use on both manned and unmanned ground, air, and sea vehicles. They undergo rigorous validation and formal qualification testing, adhering to standard test methods like DO-160 and MIL-STD-810.
- Supports PCI Express Rev 2.0 x4 or higher, backwards compatible with PCIe Rev 1.10 slots
- Up to 512MB of high-speed image memory
- Single slot solution with reconfigurable camera control and general purpose input/outputs
- High speed up to 100 kHzx3 line rate (Mono) or 300 kHz line rate (Color)
- RGB native colors (Color)
- Independent exposure control (Color)
- Subpixel spatial correction (Color)
- Sequential exposure control (Mono)
- High dynamic range (Mono)
- Up to 100 m optical cable length
- Extremely high resolution down to 3.5µm pixel size
- Image circle: 62.5 mm - 82 mm
- Optimized for specific magnifications
- 11 magnifications available: 0.07x - 2.0x
- Version with Beamsplitter available
- Best azimuth marking
- V70-Mount for easy installation
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High SNR mode (up to 24 dB better signal-to-noise ratio)
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Low-noise binning mode
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Shading correction
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Defect pixel correction
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Area of interest (AOI), separate AOI for auto features
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Binning
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Decimation
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Auto gain (manual gain control: 0 to 24.4 dB)
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Auto exposure (39 µs to 67 s)
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Auto white balance
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Look-up table (LUT)
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Hue, saturation
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Color correction
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Local color anti-aliasing
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Reverse X/Y
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Deferred image transport
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Trigger programmable, level, single, bulk, programmable delay
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Sequence mode (changes the camera settings on the fly)
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SIS (secure image signature, time stamp for trigger, frame count etc.)
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Storable user sets
Scope of delivery
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Camera and IEEE 1394b cable (other configurations on request)
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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