FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
-
Enables wafer probing up to 100 A pulsed and 10A DC
-
Innovative multi-fingertip design provides even distribution of current
-
Supports up to 500 V
-
Replaceable Tungsten probe tips
-
Temperature range of -60°C to 300°C
-
Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
-
Prevents against thermal runaway
-
Measure devices on wafer at higher currents than ever before
-
Small scrub minimizes damage to aluminum pad
-
Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
Document
Document
More Product Information
Test & Measurement
Download Line Card
Document