FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
More Product Information

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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency


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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C

A highly precise skew matching cable assembly with skew of 1psec or less between 2 cables, designed for digital transmission evaluation. Continuous operating temperature range: -30 to +85°C.
Exhibits low cable insertion loss and is suitable for high-precision differential signal transmission evaluation and measurement applications. 4 types of cables with different maximum usage frequencies (26.5GHz, 40GHz, 50GHz, and 67GHz) are available.

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Affordable Camera Link InGaAs SWIR camera
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QVGA resolution
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Compact industrial design, no fan
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Simple camera configuration via GenCP
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Compact industrial design
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Up to 344 fps at full resolution
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Camera Link interface with GenCP support
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Comprehensive I/O control options
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Automated on-board image correction
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Stabilized sensor cooling, no fan
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Extended operating temperature range

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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy

- Available in 250 MHz and 350 MHz models
- 2, 4 and 8 channel modes
- 16-bit vertical resolution
- Max Sampling rate of 1.2 GS/s
- Max sinewave frequency of 250 MHz and 350 MHz respectively


Configurable and SWaP-C optimized with maximum storage capacity, processing power, and intelligence, our ruggedized, TAA-compliant BAM servers are the perfect solutions to accelerate and sustain ever-evolving applications
- Leading Performance CPUs - Supports dual Intel® 3rd Gen Xeon® SP CPUs with hardware-based encryption for enhanced compute and networking.
- High-end GPUs and FPGAs - Supports multiple double-wide, high-end Intel® and NVIDIA® GPUs and FPGAs to accelerate AI/ML/DL workloads at the edge.
- Fast NVMe SSDs - Supports up to 8 high-speed NVMe or 9 SAS/SATA SSDs to increase read/write speeds (FIPS 140-2/3 available).

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
