FormFactor - Cascade Unity Probe - Multicontact probe for RFIC engineering test
- Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
- Online design configuration tool helps you to specify your probe in minutes
- All designs are fully quadrant compatible
- Full solution includes probes, calibration substrates, stations, accessories and software
- Scalable architecture for future needs
The multi-contact Unity Probe provides highly flexible configurability, unprecedented durability and ease-of use for RFIC engineering test. Unlike “bent-to-order” needle-probe solutions, Unity probes are quickly “built-to-order” with a precision tip cluster featuring multiple independently compliant fingers to isolate chip components from probing stresses — maximizing probe life and durability. Each contact can be configured to one or several contact types and frequencies, and the Unity Probe delivers on the legendary quality you’ve come to expect from our comprehensive suite of probing solutions.
Use our online tool to capture your design requirements and receive a quote.
More Product Information
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
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Complete Test Solutions
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Complete test solutions for emissions and immunity compliance testing of AC and DC powered products
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Single & Three Phase Operation
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Offers flexibility
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Direct PC Bus Access
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Provides high sampling rate and resolution for accurate measurements and high speed data transfers
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PC based harmonic & flicker testing
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provides real-time full color data display updates and continuous PASS/FAIL monitoring.
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Supports Global Standards
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Supports European and Japanese standards
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Easy To Use Interface
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Provides IEC test setup, data analysis, display, MS Word test reports, and data files are generated in MS Excel format
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High resolution
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Data storage to disk in for post-acquisition analysis and reporting
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Single Step
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Single Step and Fast Forward replay of recorded test data at 200 mSec
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- Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
- Guarantees fully-guarded measurements to fA and fF levels
- Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
- Allows probing of different pad materials and sizes
- Fast replacement of worn probes without the need for tools
VNA Master (500 kHz to 4 GHz)
- 2-port, 1-path Vector Network Analyzer (VNA) Intuitive Graphical User Interface (GUI) with resistive TFT Touch Screen
- Exceptional RF immunity
- 100 dB Transmission Dynamic Range Vector
- Voltmeter option, ideal for cable phase matching
+Spectrum Analyzer (9 kHz to 4 GHz)
- Dynamic Range: > 95 dB in 10 Hz RBW
- DANL: –162 dBm (1 Hz)
- Phase Noise: –100 dBc/Hz max @ 10 kHz offset at 1 GHz
- Frequency Accuracy: < ±50 ppb with GPS On
- Detectors: Peak, Negative, Sample, Quasi-peak, and true RMS
- PIM Hunting
- Standard three-year warranty (battery one-year warranty)
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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