FormFactor - Cascade Unity Probe - Multicontact probe for RFIC engineering test
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
The multi-contact Unity Probe provides highly flexible configurability, unprecedented durability and ease-of use for RFIC engineering test. Unlike “bent-to-order” needle-probe solutions, Unity probes are quickly “built-to-order” with a precision tip cluster featuring multiple independently compliant fingers to isolate chip components from probing stresses — maximizing probe life and durability. Each contact can be configured to one or several contact types and frequencies, and the Unity Probe delivers on the legendary quality you’ve come to expect from our comprehensive suite of probing solutions.
Use our online tool to capture your design requirements and receive a quote.
Use our online tool to capture your design requirements and receive a quote.
More Product Information
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
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Low insertion loss
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Low contact resistance
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Lithographically defined probe tip
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Nickel contacts
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
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FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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