FormFactor - Cascade Unity Probe - Multicontact probe for RFIC engineering test
-
Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
-
Online design configuration tool helps you to specify your probe in minutes
-
All designs are fully quadrant compatible
-
Full solution includes probes, calibration substrates, stations, accessories and software
-
Scalable architecture for future needs
The multi-contact Unity Probe provides highly flexible configurability, unprecedented durability and ease-of use for RFIC engineering test. Unlike “bent-to-order” needle-probe solutions, Unity probes are quickly “built-to-order” with a precision tip cluster featuring multiple independently compliant fingers to isolate chip components from probing stresses — maximizing probe life and durability. Each contact can be configured to one or several contact types and frequencies, and the Unity Probe delivers on the legendary quality you’ve come to expect from our comprehensive suite of probing solutions.
Use our online tool to capture your design requirements and receive a quote.
Use our online tool to capture your design requirements and receive a quote.
More Product Information

-
Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
-
Application flexibility, ideal for use in high frequency applications
-
Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
-
Suitable for integration with vibration isolating tables

-
On-wafer power device characterization up to 10,000 V DC / 600 A
-
Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
-
Prevent thin wafers from curling and breaking
-
Safety interlock system with clear enclosure for operator safety during device measurements
-
Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
-
Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
-
Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware

-
Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
-
Even distribution of high current with innovative multi-fingertip design
-
Compatible with TESLA 200/300 mm power device characterization system
-
Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
-
Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
-
Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

-
Best price per contact – typically over one million (1,000,000) touchdowns
-
RF/Microwave signal is shielded and completely air isolated in the probe body
-
Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
-
Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
-
Probe on any pad material with minimal damage

-
Continues the Infinity family’s Industry leading electrical performance
-
High temperature capability (175° C +) for automotive device characterization and other applications
-
Better tip visibility for enhanced placement accuracy and repeatability
-
Improved tip life/durability with solid rhodium contacts
-
New tip architecture enables support for narrower pitches (e.g. 25um)
-
Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness

-
Different substrate carriers for wafers up to 200 mm or single dies
-
Probe cards and/or up to eight positioners
-
Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
-
Probe positioners placed inside vacuum chamber
-
Joystick controller
-
Manual probe positioners with rotary feed-throughs
-
User-centered design minimizes training costs and enhances efficiency
-
Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays

-
Different substrate carriers for wafers up to 200 mm or single dies
-
Probe cards and/or up to eight positioners
-
Independently cooled cold shield
-
Probe positioners placed inside vacuum chamber
-
Intuitive, manual drives
-
Front loading capability through load door
-
Independent control of linear chuck stage and positioners
-
Contact/separation stroke for chuck

-
Fully isolated experiment space for true 4K temperatures during probing
-
Cryogenic positioners to provide large travel ranges without warming up the device
-
Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
-
A soft vacuum bellows provides a compliant mounting interface for the cryocooler
-
Quick release vacuum feedthroughs for easy configurability
-
A large rectangular port for high signal capacity

-
Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
-
High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
-
Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
-
Low vibration: Stable contact with the device under test and enables low noise measurements

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
