FormFactor - Cascade DCP-HTR Series Probe - High-performance DC parametric probe
- Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
- Guarantees fully-guarded measurements to fA and fF levels
- Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
- Allows probing of different pad materials and sizes
- Fast replacement of worn probes without the need for tools
The DCP-HTR probe delivers fA-level measurement capability from -65 °C to 300 °C for advanced characterization and reliability testing. Its unique design offers superior guarding and shielding over-temperature, overcoming the high-temperature performance limitations of standard coaxial needles. When used on a probe station with a MicroChamber, the DCP-HTR allows full utilization of semiconductor parametric test instruments. The optional probe tips with small diameter are ideal for probing pads as small as 30 x 30 μm.
More Product Information
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
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Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
- Coaxial and triaxial measurements up to 10,000 V
- High-quality construction with low-noise electrical performance
- Replaceable probe tips in a variety of tip sizes
- Temperature range of of -60°C to 300°C
- Triaxial measurement ensures a much better understanding of device leakage in the off state
- Highly reliable, stable and repeatable measurements
- Integrally designed as part of a complete measurement solution
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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