• Die-to-die stepping time of under 100 ms
• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Even extreme variations in height, such as the case with warped wafers, can be compensated
• Interfaces to all major analysis instrumentation, optics software and testers
• Access to top side and bottom side of device under test (DUT)
• Highly accurate light measurement
• Test automation out-of-cassette for 24/7 operation

• 32GTps, PCIe 5.0 data rate operation. Fully compatible with other PCIe data rates of 2.5, 5.0, 8.0 and 16 GTps 
• Link widths to 16-lanes, including 1-, 2-, 4-, 8-lanes 
• 256GB memory (128GB upstream and 128GB downstream) 
• Memory segmentation for capture of multiple traces 
• Host-Client connection for remote debugging using Ethernet or local debugging using USB 
• SMB capture and trigger for NVMe Management Interface (NVMe-MI) observability 
• Simultaneous capture of multiple links is allowed with multiple simultaneous users
• Decodes all PCIe, NVMe and CXL traffic at all layers of the stack including the TLP, DLLP, and PHY layer packets 
• Flexible trigger events include training sequences, ordered sets, queue pairs, PRPs, SGL, SMB, etc. 
• Cascade captures from up to four Xgig chassis into a single trace view 
• Full support of PCI Express LTSSM analysis 
• Field replaceable power supply 
• LEDs give quick indicators of power and link status 
• Includes one-year hardware and three-year software warranties 
• Works with the VIAVI Xgig software tool suite: Trace Control, Trace View, Expert™, Serialytics™ 
• Supported by a wide variety of Interposers (CEM, U.3, etc.)

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

• Wafer temp verified <4.5 K (with 44 RF probes in contact) ​
• Magnetic field suppression to <200 nT
• Easy exchange of customizable probe cards
• Configurable for 150 mm, 200 mm and 300 mm wafers
• Options for fully automated wafer load or manual​
• Complete software suite for manual, semi-auto, or fully automated probing
• 25 wafer cassette capacity for fully automated testing
• ~15 minute cooldown time per wafer

• Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
• Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
• Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
• Durable probe structure ensures more than 250,000 contacts
• Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications