• Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
• High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
• Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
• Low vibration: Stable contact with the device under test and enables low noise measurements

• Provides an effectively noise free environment around the device under test (DUT)
• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Up to 4x faster flicker noise thermal testing on 30 μm pads
• Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
• Provides fully managed and filtered AC power to the entire system – prober and instruments
• Filters harmful noise generated by external thermal control systems
• Reduced “antenna effect” injection of unwanted RF noise into the measurement path
• Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• User-centered design minimizes training costs and enhances efficiency
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Independently cooled cold shield
• Probe positioners placed inside vacuum chamber
• Intuitive, manual drives
• Front loading capability through load door
• Independent control of linear chuck stage and positioners
• Contact/separation stroke for chuck

• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution