FormFactor - Cascade PAP200 - 200 mm semi-automated vacuum and pressure probe system
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
Semi-Automated Wafer Probing in a High Vacuum or Overpressure Environment
The PAP200 is a highly-precise semi-automated probing solution for wafers and substrates up to 200 mm in a vacuum environment down to < 1×10-5 mbar or in an overpressure environment up to 4.0 bar (abs.). Designed for industrial environments and major research facilities, it supports MEMS tests and a wide range of other applications.
The PAP200 supports multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
Stability
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for demanding MEMS analysis
Ease of use
- Joystick controller
- Manual probe positioners with rotary feed-throughs
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
High measurement throughput
- Software control of chuck for fast step-and-repeat testing of the entire wafer
- Fast step-and-repeat testing of the whole wafer
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Different substrate carriers for wafers up to 200 mm or single dies
-
Probe cards and/or up to eight positioners
-
Probe positioners placed inside vacuum chamber
-
Short and stable probe arms
-
Joystick controller
-
Manual probe positioners with rotary feed-throughs
-
Software control of chuck for fast step-and-repeat testing of the entire wafer
-
Fast step-and-repeat testing of the whole wafer
-
User-centered design minimizes training costs and enhances efficiency
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
See more Key Features on Specifications & Details tab
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will
continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
FormFactor's FRT Metrology engineers designed SurfaceSens technology to achieve superior information about the measured sample and greater insights about product quality. All of our FRT MicroProf® metrology tools can be configured with complementary sensor technologies. In a hybrid analysis process, otherwise inaccessible surface data of wafers or other samples are precisely measured.
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
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Continues the Infinity family’s Industry leading electrical performance
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High temperature capability (175° C +) for automotive device characterization and other applications
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Better tip visibility for enhanced placement accuracy and repeatability
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Improved tip life/durability with solid rhodium contacts
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New tip architecture enables support for narrower pitches (e.g. 25um)
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Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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