FormFactor - Cascade Multiline TRL Cal Substrates - Multiline TRL substrates for T-Wave probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Millimeter- and submillimeter-wave calibration substrates, optimized for T-Wave™ probes. The multiline TRL calibration substrates offer CPW standards including reflect (short), thru and two lines and are recommended to use with WinCal™ calibration software. Some off-set short and off-set open structures are included for additional measurements.
Models
|
Part Number |
Description |
Pitch (μm) |
|---|---|---|
|
Multi-line TRL Substrate, WR1.0, WR2.2, WR3.4, WR4.3, WR5.1 |
25 |
|
|
Multi-line TRL Substrate, WR2.2, WR3.4, WR4.3, WR5.1 |
50 |
|
|
Multi-line TRL Substrate, WR3.4, WR4.3, WR5.1 |
75 and 100 |
More Product Information
- Accommodates a combination of up to four Cascade Microtech probes
- Configurable for mixed-signal RF/mmW testing
- Quick and easy repairs to be performed in the field, by simply replacing individual probes
- Adaptable to new device layouts by exchanging individual probes
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
See "Specifications & Details" tab for more key features
Next Generation Wafer Probing
- Continues the Infinity family’s Industry leading electrical performance
- High temperature capability (175° C +) for automotive device characterization and other applications
- Better tip visibility for enhanced placement accuracy and repeatability
- Improved tip life/durability with solid rhodium contacts
- New tip architecture enables support for narrower pitches (e.g. 25um)
- Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
T-Wave Waveguide Banded Probes
- Low insertion loss
- Low contact resistance
- 140 GHz – 1.1 THz versions
- Probe pitch as narrow as 25 μm
- Lithographically-defined probe tip
- Nickel contacts
See "Specifications & Details" tab for more key features
More than a calibration tool
- Calibration
- Validation
- Measurement
- Analysis
No one supports more VNA’s
- Support of more than 24 of the most common VNA’s
Tool for the novice
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
See "Specifications & Details" tab for more key features
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
