• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Intuitive, manual drives
• Front loading capability through load door
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

• Fully isolated experiment space for true 4K temperatures during probing
• Cryogenic positioners to provide large travel ranges without warming up the device
• Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
• A soft vacuum bellows provides a compliant mounting interface for the cryocooler
• Quick release vacuum feedthroughs for easy configurability
• A large rectangular port for high signal capacity

• Low running costs, less vibration, less noise, reduced maintenance
• Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
• CMN calibrated thermometry on MC plate
• Operation via touch panel controller: Remote operation via ethernet interface

• Provides an effectively noise free environment around the device under test (DUT)
• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Up to 4x faster flicker noise thermal testing on 30 μm pads
• Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
• Provides fully managed and filtered AC power to the entire system – prober and instruments
• Filters harmful noise generated by external thermal control systems
• Reduced “antenna effect” injection of unwanted RF noise into the measurement path
• Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• User-centered design minimizes training costs and enhances efficiency
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
• Re-configurable for DC, RF, mmW, FA, WLR and more
• Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
• Low-profile, straightforward design
• Easy and ergonomic operation
• Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Front or backside probing capability

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Independently cooled cold shield
• Probe positioners placed inside vacuum chamber
• Intuitive, manual drives
• Front loading capability through load door
• Independent control of linear chuck stage and positioners
• Contact/separation stroke for chuck