The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z0: 50 Ω

SlimVue Microscope

• Combined eye-pieces and CCD camera mount
• 3x zoom and quick lens exchange
• Quick lens exchange
• 1 um optical resolution
• Minimized scope footprint
• Fast change from navigation optics to high-resolution optics
• Resolving ‹ 50 μm pads
• Simple integration with any mmW modules

Application Specific Sigma Kits

• Engraved guides on mmW platen
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Optical feedback on platen position (gauge)
• Adaptable to any mmW/sub-THz applications
• Seamless integration with any mmW modules and tuners
• Fast mounting and setup change

THz measurement capability

• Rock-solid mechanical design
• Submicron stage accuracy
• Optical feedback on platen and probe position (gauge)
• Motorized positioner
• <+-1 um separation repeatability
• Micrometer-accurate and repeatable probe placement and overtravel
• Highly-precise and stable THz measurements

Measurement Accuracy

• Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
• Minimize AC and spectral noise with effective shielding capability
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection

See "Specifications & Details" tab for more key features

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

The Low Frequency Tuner (LFT) is a unique product technology using M algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors. The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.