FormFactor - Cascade PLC50 - 100 mm manual cryogenic probe system
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
Entry-level manual cryogenic wafer probing < 7 K
The PLC50 is a highly-precise, cost-effective probe station for wafers and substrates up to 100 mm in a high vacuum environment, at cryogenic temperatures down to 77 K with liquid nitrogen or < 7 K with liquid helium. Specially designed for laboratory requirements, it supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices, MEMS and optoelectronic tests.
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
Stability
- Independently cooled cold shield
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 7 K (liquid helium)
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
Ease of Use
- Ergonomic and straightforward design
- Simple microscope operation
- Hinged topside lid
- Comfortable and easy operation
- Quick and ergonomic change of DUT
- Topside access to probes and samples
High measurement throughput
- Independent control of linear chuck stage and positioners
- Contact/separation stroke for probe platen
- Fast, manual step-and-repeat testing of the whole wafer
- Simultaneous contacting and separation of all probes
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More Product Information
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Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
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Re-configurable and upgradable as requirements grow
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Minimizes setup times with no loss in performance or accuracy
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Seamless integration of various measurement instruments
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Solid station frame
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Built-in vibration-isolation solution for superior vibration attenuation
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Rigid microscope bridge
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Compact and rigid mechanical design
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Highly accurate measurement results
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Incorporates best-known methods
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Ergonomic and straightforward design for comfortable and easy operation
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Low-profile design
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Simple microscope operation
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Quick and ergonomic change of DUT through pull-out stage
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Minimize training efforts
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Fast time to data
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Convenient operation
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Long holding time: 80 hours with 10 STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
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Sample can be loaded or removed when the cryostat is cold
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Low noise, low vibration
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Quick and easy probe tip navigation
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Z drive can work in the same range as the chuck
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Enables higher separation gap while the DUT stays in focus
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Automatically configure and optimize performance
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24/7 operating
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Increased MTBF
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Protects the measurement setup
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Prevents involuntary mechanical contact between lens and probes
See more Key Features in Specifications & Features tab
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Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
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Reduced unwanted couplings and transmission modes
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Able to shrink pad geometries to 25 x 35 µm (best case)
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Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
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WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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