FormFactor - Cascade Resistive Matching and Termination - Custom configured for your application
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Can help to stabilize oscillations in high-gain devices
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Impedance match to low dynamic resistance laser diodes
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Custom configured for your application
Resistive Impedance Matching Probes and Termination probes are available for the following probe families: Infinity; ACP; FPC, in multiple configurations. We use high performance / high quality RF resistors for these Matching or Termination probes and the resistors are placed as close as possible to the tip/DUT, to minimize the path length between the DUT and the resistor. The available Resistance values are limited and are listed in the request form. These types of Impedance Matching and Termination probes are used in various application such as with laser diodes, Transmission Line Pulse, ensure better termination of 50 ohm test equipment when mated to high impedance devices, etc.
More Product Information
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Revolutionary technology advancement for wafer and die-level photonics probing
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Real-time in-situ calibrations
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Highest accuracy in test results
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Lowest coupling loss
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Dark, shielded and frost-free
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-40°C to +125°C
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
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Cryogen-free option available
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Flexible sample space
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Low noise, low vibration
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Long holding time
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Stable He-3 pot temperature
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
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Wafer temp verified <4.5 K (with 44 RF probes in contact)
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Magnetic field suppression to <200 nT
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Easy exchange of customizable probe cards
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Configurable for 150 mm, 200 mm and 300 mm wafers
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Options for fully automated wafer load or manual
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Complete software suite for manual, semi-auto, or fully automated probing
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25 wafer cassette capacity for fully automated testing
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~15 minute cooldown time per wafer
See more Key Features in Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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