FormFactor - Cascade Resistive Matching and Termination - Custom configured for your application
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Can help to stabilize oscillations in high-gain devices
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Impedance match to low dynamic resistance laser diodes
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Custom configured for your application
Resistive Impedance Matching Probes and Termination probes are available for the following probe families: Infinity; ACP; FPC, in multiple configurations. We use high performance / high quality RF resistors for these Matching or Termination probes and the resistors are placed as close as possible to the tip/DUT, to minimize the path length between the DUT and the resistor. The available Resistance values are limited and are listed in the request form. These types of Impedance Matching and Termination probes are used in various application such as with laser diodes, Transmission Line Pulse, ensure better termination of 50 ohm test equipment when mated to high impedance devices, etc.
More Product Information
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
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Full-radius, nickel-plated tungsten needles
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Power bypass inductance: 16 nH
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Supports collinear and non-standard needle configurations
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Support up to a maximum of 12 ceramic blades DC needles / contacts
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
Impedance Standard Substrates (ISSs) supports all of your high-frequency probing applications. Using them ensures greater accuracy and better repeatability in on-wafer calibration of vector network analyzers. Our ISSs offer the proven accuracy of LRRM calibrations with automatic load inductance compensation.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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