FormFactor - Cascade Resistive Matching and Termination - Custom configured for your application
- Choice of Series resistance or Termination (signal line to ground)
- Use of High Performance RF Resistors
- Choice of Resistor values available
- Choice of body styles, Infinity, ACP or FPC
- Can help to stabilize oscillations in high-gain devices
- Impedance match to low dynamic resistance laser diodes
- Custom configured for your application
Resistive Impedance Matching Probes and Termination probes are available for the following probe families: Infinity; ACP; FPC, in multiple configurations. We use high performance / high quality RF resistors for these Matching or Termination probes and the resistors are placed as close as possible to the tip/DUT, to minimize the path length between the DUT and the resistor. The available Resistance values are limited and are listed in the request form. These types of Impedance Matching and Termination probes are used in various application such as with laser diodes, Transmission Line Pulse, ensure better termination of 50 ohm test equipment when mated to high impedance devices, etc.
More Product Information
- Lithographic thin-film construction
- Excellent crosstalk characteristics
- Non-oxidizing nickel alloy tips
- Innovative force delivery mechanism
- 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
- GSG, SG, GS, GSGSG, GSSG, SGS configurations
- 50 to 250 µm pitches (other pitches available on request)
- High current version (2 A) available
Advantages
- Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
- Superior measurement accuracy and repeatability
- Small scrub minimizes damage to aluminum pad
- Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
- Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
- Ideal for multiport RF/Microwave and high-speed digital signal testing
- Mix DC and RF/Microwave signals on one probe
- Long lifetime – typically over one million (1,000,000) touchdowns
- Excellent performance in temperatures ranging from 10 K to 200°C
- Probe on any pad material with no damage
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
Flexibility
- Different substrate carriers for wafers up to 150 mm or single dies
- Up to six positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
- 1 µm repeatable separation stroke
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
See "Specifications & Details" tab for more key features
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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