• DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
• Full thermal range of -60°C to +300°C
• Reliable and repeatable contact
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• High thermal stability components
• On-axis probe-to-pad alignment
• Flexibility from hot only to full thermal range of -60°C to +300°C
• Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
• 3 performance level configurations (fully-shielded / shielded / open)
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
• User-centered design minimizes training costs and enhances efficiency

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Re-configurable for DC, RF, mmW, FA, WLR and more
• Full thermal range of -60°C to +300°C
• Low-profile, straightforward design
• Spacious top chambers for up to 12 positioners
• Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
• Enables accurate low-noise measurements of atto amperes, femtofarads and microvolts at temperatures down to -60°C

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency

• Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
• Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
• Sample size: Proven with chips up to 10×10 mm in size.
• Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Continues the Infinity family’s Industry leading electrical performance
• High temperature capability (175° C +) for automotive device characterization and other applications
• Better tip visibility for enhanced placement accuracy and repeatability
• Improved tip life/durability with solid rhodium contacts
• New tip architecture enables support for narrower pitches (e.g. 25um)
• Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness