FormFactor - Cascade Autonomous RF wafer probing featuring Contact Intelligence
-
Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
-
Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
-
Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
-
Calibration Monitor and Re-calibration – System will
continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
Perform True Autonomous RF and mm-Wave Measurements and Calibrations on 200mm and 300mm Probe Stations
FormFactor introduces a new assistant for autonomous calibration and measurement of RF devices over multiple temperatures. New RF devices for applications such as 5G, autonomous driving and next generation Wi-Fi, need to have the most accurate device models for their IC designs. Normal testing of RF device modelling test structures requires large amounts of time from the engineer to perform re-calibrations whenever the system drifts beyond a usable limit. Re-positioning of the probes when changing temperature, also requires user intervention.
With FormFactor’s Contact Intelligence, the operator can start a test and leave the probe station measuring during the whole shift, overnight or even over the weekend, without any user intervention. Contact Intelligence offers true hands-free and autonomous RF calibrations and measurements over multiple temperatures. Programmable positioners and, probe tip recognition algorithms coordinate with our WinCal XE calibration software to automatically recalibrate if the system performance drifts beyond a usable limit. Probes are dynamically corrected for the most accurate pad placement on-the-fly to compensate for any thermal expansion of the probes or device when changing temperature. This results in testing more devices in a shorter period of time, with a higher degree of confidence in the RF measurement performance, leading to more accurate design models and faster time to market.
The Autonomous RF Measurement Assistant is available for the following 200 mm and 300 mm probe stations: CM300xi, SUMMIT200, Summit 12000 and Elite 300.
Document
Document
Document
Document
More Product Information
Ultra Low Temperature
-
Pulse tube cryocooler for cryogen free 4K temperatures
-
Two stage ADR provides solid state cooling down to 30mK
-
Sample stage mounting at both 1K and 50mK
Configurability
-
Multiple stage feedthroughs for thermally intercepting the signals
-
Two large electrical bread boards for more configurable space
-
Rapid cool options for faster cooldowns
-
Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
-
High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
-
Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
-
Low vibration: Stable contact with the device under test and enables low noise measurements
The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.
The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.
-
On-wafer power device characterization up to 10,000 V DC / 600 A
-
Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
-
Prevent thin wafers from curling and breaking
-
Safety interlock system with clear enclosure for operator safety during device measurements
-
Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
-
Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
-
Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
-
Sample can be loaded or removed when the cryostat is cold
-
High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
-
Sample probe and a load-lock with gate valve
-
Fully isolated experiment space for true 4K temperatures during probing
-
Cryogenic positioners to provide large travel ranges without warming up the device
-
Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
-
A soft vacuum bellows provides a compliant mounting interface for the cryocooler
-
Quick release vacuum feedthroughs for easy configurability
-
A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
-
Highly stable granite base
-
Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
-
Re-configurable for DC, RF, mmW, FA, WLR and more
-
Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
-
Low-profile, straightforward design
-
Easy and ergonomic operation
-
Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
-
Front or backside probing capability
See more Key Features on Specifications & Details tab
-
Designed for use with specific Probe Systems
-
Tables to suit all facility requirements and applications
-
Stable probing, even in submicron range
-
Granite platen ensures rigidity and temperature stability
-
Can be combined with the Shield Enclosures
-
Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
-
Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
-
Supports fully automated testing up to 10kV by eliminating arcing point
-
Full wafer access via locking roll-out stage
-
On-wafer power device characterization up to 10,000 V DC / 600 A
-
Coaxial, triaxial, and pin jack feed-troughs available
-
Convenient instrument connection kits
-
Load/unload wafer to hot/cold chuck (-60° C to +300° C)
-
Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
Download Line Card
Document
