FormFactor - Cascade IMS-K-Power - Integrated system with Keysight PDA for power semiconductor device characterization
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements
Industry’s Most Productive and Accurate Power Semiconductor Device Characterization System
When testing Si and advanced GaN / SiC devices on-wafer instead of in-package, R&D engineers and test operators are faced with some major challenges to collect high accuracy data. These include the need for probe and system anti-arcing at high voltage, low resistance probe and wafer contacts for high current, and special handling for thinned wafers. Simultaneously, the need for “fast time to accurate data“ requires quick and easy setup of complex high power test configurations, with operator and device safety in mind. Tightly integrated instrumentation from industry leader Keysight completes the system to deliver best possible measurement accuracy and repeatability.
Fastest, Safest, and Most Affordable Path to High Quality Measurements
Pre-validated, turn-key, comprehensive, integrated measurement systems from FormFactor deliver peace of mind and immediate, out-of-the-box productivity for important test applications.
These benefits are provided at no extra cost. IMS solutions from FormFactor include no markups over Keysight pricing or integration charges.
Only one power semiconductor device characterization system in the world is built upon the foundations of the #1 leader in R&D instrumentation plus the #1 leader in analytical probe systems – the FormFactor IMS-K-Power.
Applications
Power Semiconductor Device Characterization
FormFactor and partner Keysight applications experts will help you configure a robust, complete solution, including:
- FormFactor probe system: TESLA300, TESLA200, EPS150TESLA (others available)
- Manual, semi-automatic and fully automatic probes station options
- FormFactor analytical probes: High Voltage Probes, High Current Probes, High-Power Probes
- T.I.P.S. “LuPo” High Voltage / High Power Probe Card (optional)
- Full over temperature measurements and automation from -60°C to +300°C
- Keysight power device analyzer (PDA): B1505A (others available)
- Keysight automation and modeling software: EasyEXPERT group+
- To complete the system: cables, adapters, mounting hardware, etc.
More Product Information
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
See more Key Features on Specifications & Details tab
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
See more Key Featueres on Specfications & Details tab
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
For more information please contact your local sales representative.
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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