FormFactor - Cascade IMS-K-Power - Integrated system with Keysight PDA for power semiconductor device characterization
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements
Industry’s Most Productive and Accurate Power Semiconductor Device Characterization System
When testing Si and advanced GaN / SiC devices on-wafer instead of in-package, R&D engineers and test operators are faced with some major challenges to collect high accuracy data. These include the need for probe and system anti-arcing at high voltage, low resistance probe and wafer contacts for high current, and special handling for thinned wafers. Simultaneously, the need for “fast time to accurate data“ requires quick and easy setup of complex high power test configurations, with operator and device safety in mind. Tightly integrated instrumentation from industry leader Keysight completes the system to deliver best possible measurement accuracy and repeatability.
Fastest, Safest, and Most Affordable Path to High Quality Measurements
Pre-validated, turn-key, comprehensive, integrated measurement systems from FormFactor deliver peace of mind and immediate, out-of-the-box productivity for important test applications.
These benefits are provided at no extra cost. IMS solutions from FormFactor include no markups over Keysight pricing or integration charges.
Only one power semiconductor device characterization system in the world is built upon the foundations of the #1 leader in R&D instrumentation plus the #1 leader in analytical probe systems – the FormFactor IMS-K-Power.
Applications
Power Semiconductor Device Characterization
FormFactor and partner Keysight applications experts will help you configure a robust, complete solution, including:
- FormFactor probe system: TESLA300, TESLA200, EPS150TESLA (others available)
- Manual, semi-automatic and fully automatic probes station options
- FormFactor analytical probes: High Voltage Probes, High Current Probes, High-Power Probes
- T.I.P.S. “LuPo” High Voltage / High Power Probe Card (optional)
- Full over temperature measurements and automation from -60°C to +300°C
- Keysight power device analyzer (PDA): B1505A (others available)
- Keysight automation and modeling software: EasyEXPERT group+
- To complete the system: cables, adapters, mounting hardware, etc.
More Product Information
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
See more Key Features on Specifications & Details tab
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will
continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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