FormFactor - Cascade Shield Enclosure Light-tight probing
- Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
- Application flexibility, ideal for use in high frequency applications
- Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
- Suitable for integration with vibration isolating tables
Shield Enclosures are designed for durable stability and sized to accommodate analytical probers equipped with all kinds of accessories, including thermal chucks, laser cutters, TV and emission cameras. The EMI-shielded version guarantees a light-tight and electromagnetically shielded environment for all sensitive measurements.
More Product Information
The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
- On-Off power switch
- 20 A Circuit Breaker
- 8’ Flexible Power Cord
- Outlets – (4) 5-20R
Test Tap:
- 3ft.
- (2) fork terminals (current)
- (1) fork terminals (ground)
- (2) Shielded Banana (voltage)
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
- Lithographic thin-film construction
- Excellent crosstalk characteristics
- Non-oxidizing nickel alloy tips
- Innovative force delivery mechanism
- 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
- GSG, SG, GS, GSGSG, GSSG, SGS configurations
- 50 to 250 µm pitches (other pitches available on request)
- High current version (2 A) available
Advantages
- Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
- Superior measurement accuracy and repeatability
- Small scrub minimizes damage to aluminum pad
- Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
- Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
Measurement Accuracy
- Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
- Minimize AC and spectral noise with effective shielding capability
- Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
- Shortest signal path test integration for accurate, thermally stable, and low-error data collection
See "Specifications & Details" tab for more key features
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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