FormFactor - Cascade Shield Enclosure Light-tight probing
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
Shield Enclosures are designed for durable stability and sized to accommodate analytical probers equipped with all kinds of accessories, including thermal chucks, laser cutters, TV and emission cameras. The EMI-shielded version guarantees a light-tight and electromagnetically shielded environment for all sensitive measurements.
More Product Information

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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns

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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation


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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve

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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

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Infinity Probe: best for Al (Si)
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ACP Probe: best for AU (III-Vs)
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|Z| Probe: robust solution (long lifetime)
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RF chuck ±3 μm surface planarity
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Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
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Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
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Automated calibration monitoring

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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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15’ Flexible Power Cord
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IEC C13 / C14 Connectors
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3ft.
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(2) fork terminals (current)
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(1) fork terminals (ground)
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(2) Shielded Banana (voltage)

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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
