FormFactor - Cascade Shield Enclosure Light-tight probing
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
Shield Enclosures are designed for durable stability and sized to accommodate analytical probers equipped with all kinds of accessories, including thermal chucks, laser cutters, TV and emission cameras. The EMI-shielded version guarantees a light-tight and electromagnetically shielded environment for all sensitive measurements.
More Product Information
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Cryogen-free option available
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Flexible sample space
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Low noise, low vibration
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Long holding time
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Stable He-3 pot temperature
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Revolutionary technology advancement for wafer and die-level photonics probing
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Real-time in-situ calibrations
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Highest accuracy in test results
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Lowest coupling loss
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Dark, shielded and frost-free
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-40°C to +125°C
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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On-Off power switch
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30 A Circuit Breaker
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Inlet - NEMA L6-30
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Outlets – NEMA L6-30R
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3ft.
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(2) fork terminals (current)
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(1) fork terminals (ground)
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(2) Shielded Banana (voltage)
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
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Interposers: x8 and x16 Slot, x4 Flying Lead pod, x4 M.2, x4 U.2 (available in dual port), and x16 SFF-8644
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1U+ chassis with 128GB memory (64GB upstream and 64GB downstream)
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Host-Client connection for remote debugging using Ethernet or local debugging using USB
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SMB capture and trigger for NVMe Management Interface (NVMe-MI) observability
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Simultaneously Analyze and Jam on a single chassis using one interposer
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Decodes all PCIe and NVMe traffic at all layers of the stack including the TLP, DLLP, and PHY layer logic sub-blocks
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Trigger and Search events include training sequences, ordered sets, queue pairs, PRPs, Scatter/Gather Lists (SGL), SMB, etc.
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The Tap Upstream and Downstream ports allow AJA configuration Jamming
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Cascade up to 4 Xgig captures into a single trace view
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Full support of LTSSM for PCI Express
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Memory segmentation for capture of multiple traces
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Field replaceable modular fan and power supply assemblies
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Portable, lightweight, and stand-alone
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One-year hardware and three-year software warranties for the Xgig 4K16 PCI Express 4.0 Protocol Analyzer/Jammer
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000