FormFactor - Cascade Autonomous DC wafer probing featuring Contact Intelligence
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
With FormFactor’s Contact Intelligence, the operator can start a test and leave the system measuring during the whole shift, overnight or even over the weekend, without any user intervention. Probes are dynamically corrected for the most accurate pad placement on-the-fly to compensate for any thermal expansion of the probes or device when changing temperature. Contact Intelligence modules enable complete hands-free 24/7 operation using motorized probe positioners for small pad touchdown optimization, automatic testing over multiple different temperatures, and automatic probe layout spacing for testing sub dies. Both, single DUT probe layouts, and multi-DUT layouts can be easily called by Test Executive software for complete automation. The Contact Intelligence system takes care of all the complex autonomous management of thermal transitions, and thermal soak time optimization of probe-to-pad alignment (PTPA). This results in testing more devices in a shorter period of time, with a higher degree of confidence in the DC measurements, leading to more accurate data and faster time to market.
When integrated with noise test equipment (flicker noise, RTN, phase noise) on the new CM300xi-ULN, the system offers the industry’s highest test throughput for ultra-low noise probing with low contact resistance on small pads down to 30µm. All capabilities are optimized to ensure ultra-low noise performance is not compromised.
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The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
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Coaxial and triaxial measurements up to 10,000 V
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High-quality construction with low-noise electrical performance
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Replaceable probe tips in a variety of tip sizes
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Temperature range of -60°C to 300°C
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Triaxial measurement ensures a much better understanding of device leakage in the off state
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Highly reliable, stable and repeatable measurements
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Integrally designed as part of a complete measurement solution
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
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Accommodates a combination of up to four Cascade Microtech probes
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Configurable for mixed-signal RF/mmW testing
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Quick and easy repairs to be performed in the field, by simply replacing individual probes
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Adaptable to new device layouts by exchanging individual probes
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Can help to stabilize oscillations in high-gain devices
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Impedance match to low dynamic resistance laser diodes
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Custom configured for your application
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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