FormFactor - Cascade Autonomous DC wafer probing featuring Contact Intelligence
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
With FormFactor’s Contact Intelligence, the operator can start a test and leave the system measuring during the whole shift, overnight or even over the weekend, without any user intervention. Probes are dynamically corrected for the most accurate pad placement on-the-fly to compensate for any thermal expansion of the probes or device when changing temperature. Contact Intelligence modules enable complete hands-free 24/7 operation using motorized probe positioners for small pad touchdown optimization, automatic testing over multiple different temperatures, and automatic probe layout spacing for testing sub dies. Both, single DUT probe layouts, and multi-DUT layouts can be easily called by Test Executive software for complete automation. The Contact Intelligence system takes care of all the complex autonomous management of thermal transitions, and thermal soak time optimization of probe-to-pad alignment (PTPA). This results in testing more devices in a shorter period of time, with a higher degree of confidence in the DC measurements, leading to more accurate data and faster time to market.
When integrated with noise test equipment (flicker noise, RTN, phase noise) on the new CM300xi-ULN, the system offers the industry’s highest test throughput for ultra-low noise probing with low contact resistance on small pads down to 30µm. All capabilities are optimized to ensure ultra-low noise performance is not compromised.
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The automotive industry is a sector frequently on the cusp of transformation. Fast-paced industry shifts span technology innovations, regulatory standards, green initiatives, and customer expectations, influencing manufacturers’ testing needs, growth objectives, and overall business strategies. Companies striving for a competitive edge focus on sustainable practices, regulatory compliance, and innovation in Electric Vehicles (EVs), alternative fuels, and autonomous driving systems. This positions the automotive industry in vital need of testing facilities that are future-proofed for rapid and ongoing transformation.
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Can help to stabilize oscillations in high-gain devices
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Impedance match to low dynamic resistance laser diodes
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Custom configured for your application
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
For more information please contact your local sales representative.
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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