FormFactor - Cascade PAC200 - 200 mm semi-automated cryogenic probe system
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Semi-/fully- automated cryogenic wafer probing down to 10 K
The PAC200 is a highly-precise semi-automated probe station for wafers and substrates up to 200 mm (with a 300 mm option) in a high vacuum environment, at cryogenic temperatures down to 77 K with liquid nitrogen or down to 10 K with liquid helium. Dry-cooling options are also available.
Designed for industrial environments and major research facilities, it supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices, MEMS and optoelectronic tests. Optionally, the PAC200 can also be equipped with an autoloader, turning it into a fully automated cryogenic probe station (see videos below).
The PAC200 supports multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Stability
- Ice- and condensation-free probing down to 77 K (liquid nitrogen) or down to 10 K (liquid helium or cryo-cooler)
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for high-resolution microscopes
Ease of Use
- Joystick controller
- Manual probe positioners with rotary feed-throughs
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
Document
Document
Document
Document
Document
Document
More Product Information
- Lithographic thin-film construction
- Excellent crosstalk characteristics
- Non-oxidizing nickel alloy tips
- Innovative force delivery mechanism
- 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
- GSG, SG, GS, GSGSG, GSSG, SGS configurations
- 50 to 250 µm pitches (other pitches available on request)
- High current version (2 A) available
Advantages
- Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
- Superior measurement accuracy and repeatability
- Small scrub minimizes damage to aluminum pad
- Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
- Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
- Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
- Guarantees fully-guarded measurements to fA and fF levels
- Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
- Allows probing of different pad materials and sizes
- Fast replacement of worn probes without the need for tools
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.
The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
See "Specifications & Details" tab for more key features
DC, RF and Optical Probe Positioning for Highest Accuracy Measurements
FormFactor offers a wide variety of manual and motorized probe positioners for any application from DC to terahertz measurements and beyond.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
-
Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
-
Utilizes ACP tip design, GSG, GS or SG
-
RF tips available from DC to 110 GHz
-
Choice of BeCu or tungsten tips
-
DC power needles come standard with 100 pF microwave capacitor
-
Power bypass inductance: 8 nH
-
Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
-
Ideal for probing the entire circuit for functional test
-
Dual ACP configuration supports differential signaling applications
-
DC probes can provide power or slow logic to circuit under test
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
Download Line Card
