FormFactor - Cascade PAC200 - 200 mm semi-automated cryogenic probe system
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
See more Key Features on Specifications & Details tab
Semi-automated cryogenic wafer probing < 20 K
The PAC200 is a highly-precise semi-automated probe station for wafers and substrates up to 200 mm in a high vacuum environment, at cryogenic temperatures down to 77 K with liquid nitrogen or < 20 K with liquid helium. Designed for industrial environments and major research facilities, it supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices, MEMS and optoelectronic tests.
The PAC200 supports multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
Stability
- Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for high-resolution microscopes
Ease of Use
- Joystick controller
- Manual probe positioners with rotary feed-throughs
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
See more Key Features on Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
For more information please contact your local sales representative.
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Accommodates a combination of up to four Cascade Microtech probes
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Configurable for mixed-signal RF/mmW testing
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Quick and easy repairs to be performed in the field, by simply replacing individual probes
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Adaptable to new device layouts by exchanging individual probes
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Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
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Re-configurable and upgradable as requirements grow
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Minimizes setup times with no loss in performance or accuracy
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Seamless integration of various measurement instruments
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Solid station frame
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Built-in vibration-isolation solution for superior vibration attenuation
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Rigid microscope bridge
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Compact and rigid mechanical design
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Highly accurate measurement results
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Incorporates best-known methods
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Ergonomic and straightforward design for comfortable and easy operation
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Low-profile design
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Simple microscope operation
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Quick and ergonomic change of DUT through pull-out stage
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Minimize training efforts
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Fast time to data
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Convenient operation
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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy
See more Key Features on Specifications & Details tab
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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