• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• Mechanical Platen Lift: Enhances safety during complex RF set-ups, increasing operator confidence and minimizing the risk of errors.
• Ease of Use and Advanced Automation: Fully compatible with FormFactor’s Autonomous RF and DC measurement assistants, as well as Velox Dash™ companion app control.
• Reconfigurable Platen Inserts: Quickly switch between TopHat, PCH, and IceShield inserts within minutes to support a wide variety of test configurations.
• Spacious Platen Design: Provides flexibility for both RF and DC setups without space limitations, ensuring easy integration of different configurations.
• Compact Design: Small footprint with field-upgradable components for smooth integration into existing test cells.
• Low-Volume MicroChamber and FemtoGuard Thermal Triaxial Chuck: Included by default

T-Wave Waveguide Banded Probes

• Low insertion loss
• Low contact resistance
• 140 GHz – 1.1 THz versions
• Probe pitch as narrow as 25 μm
• Lithographically-defined probe tip
• Nickel contacts

See "Specifications & Details" tab for more key features

• Allows TekProbe interface level II probes to work with any ProBus-equipped Teledyne LeCroy oscilloscope 
• Automatic probe detection 
• Provides all necessary power and offset control to the attached probe 
• Supports probes up to 4 GHz 
• Easy firmware updates 
• Wide variety of probes supported including: Preamplifiers, Current Probes, Single-Ended Active Probes and Differential Active Probes

• IEC 61000-4-4 Ed.3 standard compliance. 
• Pre-check function is installed. Inspection before testing is now easy. 
• Normal mode test support. Taking account of field troubles is possible. (option) 
• Utilize an outlet box that simplifies EUT connection. (option) 
• Compared with conventional products, the size has become compact. (Approximately 67% by volume) 
• Easy to understand Panel display reduces mistakes in connecting power cables. 
• Software control with Windows. (option) 
• Next calibration date can be notified. (Windows software only) 
• Employ LCD screen with multi-language support and enhanced operability. 
• Maximum output voltage of 5 kV and maximum pulse frequency of 2 MHz allow you to test above the standard test level. 
• CDN capacity is increased to single phase type AC 240 V 20 A, single and three phase type to AC 600 V 63 A, supporting wider range of EUT. 
• Large capacity CDN (100 A or 150 A) option available for Injection test on various EUT. 
• Using coupling clamps, EMS probe kits, you can test the signal lines and evaluate the noise immunity on the PCB. (option)

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Accessories available, such as black bodies and optical motion analysis tools
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

• A real-time diagnostic tool supports EMC/EMI debugging. 
• Fast visualize EMC/EMI problems. 
• Enables easy comparison of countermeasures before and after. 
• Capable of measurement from entire products to single components. 
• Factor-editor function provides correction of antenna characteristics, cable loss and preamplifier. 
• User friendly compact design. 
• Customer supplied spectrum and probes acceptable (Please consult)

OptoVue

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

Horizontal Die-Level Edge Coupling

• Highest accuracy in test results
• Lowest coupling loss
• Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
• Reduced risk of damaging fibers with collision avoidance technology
• Ease of use for less experienced users
• Enables close simulation of real-world conditions with device performance closest to the final application

See "Specifications & Details" tab for more key features

Next Generation Wafer Probing

• Continues the Infinity family’s Industry leading electrical performance
• High temperature capability (175° C +) for automotive device characterization and other applications
• Better tip visibility for enhanced placement accuracy and repeatability
• Improved tip life/durability with solid rhodium contacts
• New tip architecture enables support for narrower pitches (e.g. 25um)
• Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness