FormFactor - Cascade DC-Q Probe - Multi-contact DC probe with flat tip needles
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
The DCQ probes use controlled impedance, ceramic blade needles for low noise and high performance. This needle style allows the placement of high-quality bypass capacitors with very little series inductance due to their close proximity to the probe tip. All of the needles are connected to a common ground plane but individual needles can be easily (ground) isolated for additional low noise performance. A maximum of 16 needles are available for standard configurations and a maximum of 24 needles for custom configurations.
More Product Information
- Easy to Use
- No need to break the circuit or insert a shunt
- Small form factors for use on crowded boards
- Variety of Applications
- Bandwidths up to 100 MHz
- Peak currents up to 700 A
- Sensitivities down to 1mA/div
- High Precision Measurements
- Low frequency accuracy of 1%
- Integrated autozero capability
- Fully Integrated with Teledyne LeCroy Oscilloscope
- No additonal hardware is required
- Power is supplied from oscilloscope ProBus connection
- Automatic display of waveforms in Amps and calculated power traces scaled correctly in Watts
- Degauss and Autozero directly from oscilloscope user interface
- DCS025 Deskew Calibration Source
- Provides ability to precisely deskew most voltage probes along with 30, 150 and 500A current probes
The PPS®1350 Hall Effet plasma thruster draws on Safran’s long experience with electric propulsion. It is designed for orbital transfer, station keeping and deorbiting satellites and other spacecraft. In particular, the PPS 1350 was the primary engine on ESA’s lunar probe, Smart-1, launched in 2003 by an Ariane 5 rocket. This mission was completed in September 2006.
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
-
Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
-
DC to 110 GHz models available in single and dual line versions
-
Low insertion and return loss with ultra-low-loss ( -L ) versions
-
Excellent crosstalk characteristics
-
Wide operating temperature -65 ° C to + 200 ° C
-
Wide range of pitches available, from 50 to 1250 µm
-
Individually supported contacts
-
Reduced contact (RC) probe tips for small pads
-
BeCu tip provides rugged, repeatable contact on gold pads
Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
Download Line Card
