FormFactor - Cascade DC-Q Probe - Multi-contact DC probe with flat tip needles
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
The DCQ probes use controlled impedance, ceramic blade needles for low noise and high performance. This needle style allows the placement of high-quality bypass capacitors with very little series inductance due to their close proximity to the probe tip. All of the needles are connected to a common ground plane but individual needles can be easily (ground) isolated for additional low noise performance. A maximum of 16 needles are available for standard configurations and a maximum of 24 needles for custom configurations.
More Product Information
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
The PPE6KV-A and HVP120 can handle up to 6000 Vpeak transient overvoltages and are designed for probing up to 2000 Vrms and 1000 Vrms respectively. Fast rise times, excellent frequency response, and a variety of standard accessories make these probes safe and ideal for high voltage measurement applications
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
The MP Series of Field Monitoring Packages are combinations of AR Field Monitors and Field Probe Kits. Each package contains all the necessary equipment to make Field measurements.
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Multipoint temperature measurements on the same probe
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Ease of installation simple and repeatable installation
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500 and 700 °C capable
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Up to 304 sensors on a single HYPERION instrument
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Multiparameter various physical parameters measurements coupled onto the same instrumentation platform
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Included in ENLIGHT’s sensor templates - allows for quick and easy optical to temperature conversions
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000