• Low running costs, less vibration, less noise, reduced maintenance
• Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
• CMN calibrated thermometry on MC plate
• Operation via touch panel controller: Remote operation via ethernet interface

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

• Easy and fast setup of camera views
• Go to Light and Image Settings of the selected camera view with only one mouse click
• Guided workflows for wafer setups, alignment tools and Autonomous Assistants
• Workflow wizard shows task-relevant settings and options only
• Visualizes the progress of setup, alignment and measurement tasks
• Status information always at hand
• Informs the user about events, for example “Successful Alignment”
• Interacts with the user and helps with intelligent solutions
• For very complex wafer structures
• Enables automatic test of multiple devices in each die location before stepping to the next die

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
• Prevent thin wafers from curling and breaking
• Safety interlock system with clear enclosure for operator safety during device measurements
• Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
• Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
• Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware