• Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
• Application flexibility, ideal for use in high frequency applications
• Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
• Suitable for integration with vibration isolating tables

• Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
• High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
• Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
• Low vibration: Stable contact with the device under test and enables low noise measurements

• DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
• Full thermal range of -60°C to +300°C
• Reliable and repeatable contact
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• High thermal stability components
• On-axis probe-to-pad alignment
• Flexibility from hot only to full thermal range of -60°C to +300°C
• Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
• 3 performance level configurations (fully-shielded / shielded / open)
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
• User-centered design minimizes training costs and enhances efficiency

• Wafer temp verified <4.5 K (with 44 RF probes in contact) ​
• Magnetic field suppression to <200 nT
• Easy exchange of customizable probe cards
• Configurable for 150 mm, 200 mm and 300 mm wafers
• Options for fully automated wafer load or manual​
• Complete software suite for manual, semi-auto, or fully automated probing
• 25 wafer cassette capacity for fully automated testing
• ~15 minute cooldown time per wafer

• Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
• Utilizes ACP tip design, GSG, GS or SG
• RF tips available from DC to 110 GHz
• Choice of BeCu or tungsten tips
• DC power needles come standard with 100 pF microwave capacitor
• Power bypass inductance: 8 nH
• Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
• Ideal for probing the entire circuit for functional test
• Dual ACP configuration supports differential signaling applications
• DC probes can provide power or slow logic to circuit under test

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.