FormFactor - Cascade DC-Q Probe - Multi-contact DC probe with flat tip needles
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
The DCQ probes use controlled impedance, ceramic blade needles for low noise and high performance. This needle style allows the placement of high-quality bypass capacitors with very little series inductance due to their close proximity to the probe tip. All of the needles are connected to a common ground plane but individual needles can be easily (ground) isolated for additional low noise performance. A maximum of 16 needles are available for standard configurations and a maximum of 24 needles for custom configurations.
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More Product Information
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Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
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Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
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LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
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Automatic load inductance compensation function ensures the most repeatable calibrations
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Easy to use Probe to ISS/CSR matching tool
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Additional remoting methods
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Interface with Velox™ over LAN
IRIS optical ground stations are built to cater to a wide range of applications (LEO/GEO/Probes), including Earth observation, high throughput bi-directional telecommunications, feeder link, or deep space missions. The IRIS systems leverage the Cortex Lasercom, a globally recognized optical modem that supports various standards such as SDA, CCSDS, and HPE.
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Coaxial and triaxial measurements up to 10,000 V
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High-quality construction with low-noise electrical performance
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Replaceable probe tips in a variety of tip sizes
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Temperature range of -60°C to 300°C
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Triaxial measurement ensures a much better understanding of device leakage in the off state
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Highly reliable, stable and repeatable measurements
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Integrally designed as part of a complete measurement solution
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
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Long holding time: 80 hours with 10 STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
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Sample can be loaded or removed when the cryostat is cold
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Low noise, low vibration
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
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FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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