FormFactor - HPD Model HE-3-TLSL - Wet Helium-3 Cryostat
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
The Model HE-3-TLSL cryostat is a top-loading system with sample in (He-3) liquid for fast sample exchange. The design allows the sample to be removed from and introduced directly into the He-3 pot while the cryostat is cold. The system also includes a sample probe and a load-lock with gate valve, plus an external gas handling system for safe insertion and removal of the sample in and out of the He-3 chamber.
This He-3 cryostat includes the following components:
- Charcoal sorption pump with heater and thermometer
- 1 K pot with thermometer
- He-3 pot (sample chamber)
- Load-lock
- Sample probe with thermal anchor stage, thermometer, and heater
- IVC can
- External gas handling system with stored He-3 gas
- External sorption cryo-pump
- Operation test
More Product Information
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Monochrome (G-032B) and color (G-032C) models
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GigE Vision interface with Power over Ethernet option
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Comprehensive I/O functionality for simplified system integration
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads on top and bottom of housing or optional tripod adapter
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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IMX250 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-508m) and color (1800 C-508c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
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IMX287 CMOS sensor
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ALVIUM image processing
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USB3 Vision
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Various hardware options
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Monochrome (1800 U-040m) and color (1800 U-040c) models
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ALVIUM® Technology for on-board image processing
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USB3 Vision interface for GenICam SFNC features
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Platform concept that enables the operation of different Alvium camera models with a common software
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Micro-B USB 3.1 Gen 1 connector with screw locks for industrial applications
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for both embedded and machine vision applications
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Type APS-H CMOS sensor
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IEEE 1588 PTP
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Power over Ethernet
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4.59 fps at full resolution
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Extended near-infrared (GT5120NIR) model
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GigE Vision interface with Power over Ethernet
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Trigger over Ethernet Action Commands allow for a single cable solution to reduce system costs
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Comprehensive I/O functionality for simplified system integration
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Planarity adjusted (PA) EF Lens Mount (option -18) for electronic control of aperture and autofocus
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Easy camera mounting via standard M3 threads at all sides and 1/4-20 tripod mounting hole
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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Enhanced Defect Pixel Correction feature with a new Defective Pixel List Manager tool that allows you to load different user defined defective pixel lists to match your application and optimize the life cycle of the camera
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000