FormFactor - HPD Model HE-3-TLSL - Wet Helium-3 Cryostat
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
The Model HE-3-TLSL cryostat is a top-loading system with sample in (He-3) liquid for fast sample exchange. The design allows the sample to be removed from and introduced directly into the He-3 pot while the cryostat is cold. The system also includes a sample probe and a load-lock with gate valve, plus an external gas handling system for safe insertion and removal of the sample in and out of the He-3 chamber.
This He-3 cryostat includes the following components:
- Charcoal sorption pump with heater and thermometer
- 1 K pot with thermometer
- He-3 pot (sample chamber)
- Load-lock
- Sample probe with thermal anchor stage, thermometer, and heater
- IVC can
- External gas handling system with stored He-3 gas
- External sorption cryo-pump
- Operation test
More Product Information
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Versatile temperature range for extreme environments
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IEEE 1588 PTP
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Power over Ethernet
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P-Iris and DC-Iris lens control
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Near-Infrared (GT2000NIR) model
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GigE Vision interface with Power over Ethernet
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Trigger over Ethernet Action Commands allow for a single cable solution to reduce system costs
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Comprehensive I/O functionality for simplified system integration
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads or optional tripod adapter
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
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Low insertion loss
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Low contact resistance
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Lithographically defined probe tip
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Nickel contacts
See more Key Features on Specifications & Details tab
- Tackle demanding imaging applications using an eighth-generation Intel Core processor
- Capture directly from GigE Vision® and USB3 Vision® cameras
- Broaden support for Camera Link® , CoaXPress® , DisplayPort, HDMI, and SDI video interfaces using Zebra frame grabbers
- Customize I/O capabilities through four PCIe slots accepting full-height, half-length cards
- Install in space-limited industrial environments given its small footprint and rugged design
- Streamline application development using the Aurora Design Assistant flowchart-based IDE or the Aurora Imaging Library SDK
- Tackle machine vision applications with utmost confidence using field-proven tools for analyzing, locating, classifying, measuring, reading, and verifying
- Leverage machine learning including deep learning to categorize image content
- Ready for deep learning training with suitably equipped and configured model
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
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IMX392 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-240m) and color (1800 C-240c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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