• Different substrate carriers for wafers up to 150 mm or single dies
• Up to six positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Ergonomic and straightforward design
• Intuitive, manual operation
• Independent control of linear chuck stage and positioners
• Contact/separation stroke for probe platen

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

• Re-configurable for DC, RF, mmW, FA, WLR and more
• Thermal range: -60˚C to 300˚C available
• Upgrade path to meet your future needs
• Stable and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Advanced EMI-shielding with PureLine with AttoGuard technologies
• Best solution for low-noise and 1/f measurements
• Minimize AC and spectral noise
• Minimizes settling times for efficient measurements, without compromising accuracy over full thermal range
• Locking roll-out stage
• Innovative microscope remote control
• Intuitive ergonomic stage controls
• Quick, safe, and comfortable wafer access
• Easy on-wafer navigation
• Fast setup and test data gathering
• Dedicated Velox version for manual probe stations
• AugmentedAlign tool with on screen markers for improved RF measurement accuracy

• Low running costs, less vibration, less noise, reduced maintenance
• Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
• CMN calibrated thermometry on MC plate
• Operation via touch panel controller: Remote operation via ethernet interface

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

• Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
• Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
• Sample size: Proven with chips up to 10×10 mm in size.
• Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.

• Provides an effectively noise free environment around the device under test (DUT)
• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Up to 4x faster flicker noise thermal testing on 30 μm pads
• Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
• Provides fully managed and filtered AC power to the entire system – prober and instruments
• Filters harmful noise generated by external thermal control systems
• Reduced “antenna effect” injection of unwanted RF noise into the measurement path
• Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• User-centered design minimizes training costs and enhances efficiency
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation