FormFactor - Cascade PMC200 - 200 mm manual cryogenic probe system
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Advanced manual cryogenic wafer probing < 7 K
The PMC200 is a highly-precise, advanced manual probe system for wafers and substrates up to 200 mm in a high vacuum environment, at cryogenic temperatures down to 77 K with liquid nitrogen or < 7 K with liquid helium. Designed for educational and industrial environments, it supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices, MEMS and optoelectronic tests.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Stability
- Independently cooled cold shield
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Optional upgrade for 300 mm wafer
- Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 7 K (liquid helium)
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for high-resolution microscopes
Ease of Use
- Intuitive, manual drives
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
High measurement throughput
- Independent control of linear chuck stage and positioners
- Contact/separation stroke for chuck
- Fast, manual step-and-repeat testing of the whole wafer
- Simultaneous contacting and separation of all probes
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More Product Information
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
- Accommodates a combination of up to four Cascade Microtech probes
- Configurable for mixed-signal RF/mmW testing
- Quick and easy repairs to be performed in the field, by simply replacing individual probes
- Adaptable to new device layouts by exchanging individual probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
- Ideal for multiport RF/Microwave and high-speed digital signal testing
- Mix DC and RF/Microwave signals on one probe
- Long lifetime – typically over one million (1,000,000) touchdowns
- Excellent performance in temperatures ranging from 10 K to 200°C
- Probe on any pad material with no damage
- Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
- Reduced unwanted couplings and transmission modes
- Able to shrink pad geometries to 25 x 35 µm (best case)
- Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
- WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
- High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
- RF bandwidth to 500 MHz
- Long probe life: > 250,000 contacts
- Beryllium-copper tips for gold pads or tungsten for aluminum pads
- Oscillation-free testing of wide-bandwidth analog circuits
- Use with ACP series probes to provide functional at-speed testing for known-good-die
- Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
- Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
