FormFactor - Cascade TESLA200 - 200 mm semi-/ fully-automated on-wafer power device characterization system
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
Designed specifically for IGBT/power MOSFET (GaN, SiC, Si) device measurements at the wafer level, the new TESLA200 on-wafer power semiconductor probing system is engineered to provide accurate data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current). With next generation test capabilities, anti-arcing solutions, wafer automation, and support for both engineering probes and T.I.P.S. “LuPo” High Voltage / High Power Probe Cards, the TESLA200 now enables complete thermal testing (-55°C to 300 °C) with fully-automatic thinned/warped/TAIKO wafer loading. One system covers all on-wafer high power test needs, from R&D to niche production.
The new TESLA200, available in semi-automatic and fully-automatic models, is scalable and field upgradeable, allowing it to meet any budget requirements. The system is ideal for collecting high accuracy measurement data on single or volume wafers as fast as possible, and can be utilized in R&D, device characterization/modelling or niche production applications.
Patented AttoGuard® and MicroChamber® technologies built in TESLA200 significantly improve low-leakage and low-capacitance measurements. In combination with FormFactor’s patented TESLA FemtoGuard™ thermal chuck technology, the TESLA200 provides an ultra-low noise, fully guarded and shielded test environment. The high-power TESLA FemtoGuard chuck also incorporates MicroVac™ technology enabling low-contact resistance, thin-wafer handling and maximum power dissipation.
To ensure the utmost safety during high-voltage measurements, the TESLA200 on-wafer power semiconductor probing system employs a TUV-certified safety interlock system integrated with an ergonomic clear enclosure. With an advanced 200 mm fast stage, automatic wafer loader and thin wafer handling capability, TESLA200 provides everything needed for scientists, R&D / test engineers, or production operators to get their job done fast.
Applications
- High Power
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
- On-wafer power device characterization up to 10,000 V DC
- Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
Safety for Operator
- Safety interlock system with clear enclosure for operator safety during device measurements
- Roll-out stage for full wafer access and easy wafer loading/unloading
Seamless Integration
- Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
- Seamless integration between Velox and analyzers/measurement software
Thermal Measurements
- Wide range of extremly performant, reliable thermal chuck systems from ATT
- Flexibility from hot only to full thermal range of -60°C to +300°C
- Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
- Up to 15% faster transition times than other systems in the market
- Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
- Field-upgradeable: grows with your needs
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
- Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- Loader integration – Easy creation of workflows and receipts and no need for any additional software
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
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Low insertion loss
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Low contact resistance
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Lithographically defined probe tip
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Nickel contacts
See more Key Features on Specifications & Details tab
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
See more Key Featueres on Specfications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
See more Key Features on Specifications & Details tab
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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