• Lithographic thin-film construction
• Excellent crosstalk characteristics
• Non-oxidizing nickel alloy tips
• Innovative force delivery mechanism
• 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
• GSG, SG, GS, GSGSG, GSSG, SGS configurations
• 50 to 250 µm pitches (other pitches available on request)
• High current version (2 A) available

Advantages

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC
• Can help to stabilize oscillations in high-gain devices
• Impedance match to low dynamic resistance laser diodes
• Custom configured for your application

Superior Mechanics

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Excellent measurement accuracy and repeatability
• Fast navigation and high-precision probe positioning

See "Specifications & Details" tab for more key features

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z0: 50 Ω

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

Gold-plated TESLA High-power MicroVac™ Chucks

• Prevent thin wafers from curling and breaking
• Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

Three Probe Technologies

• Infinity Probe: best for Al (Si)
• ACP Probe: best for AU (III-Vs)
• |Z| Probe: robust solution (long lifetime)
• Precision contact on a wide variety of materials from 26 GHz to 67 GHz
• Accurate results with excellent crosstalk
• Matching cables and substrates included

Precise Contact Solution

• RF chuck ±3 μm surface planarity
• Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
• Precision probe alignment
• Consistent contact force and overtravel
• Stable contact performance

WinCal Calibration Software

• Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
• Automated calibration monitoring
• Unique measurement & analysis methods
• Accurate S-parameter measurements
• Automatic calibration setup for higher efficiency
• Fast and easy data interpretation and reporting