• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
• Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
• Sample size: Proven with chips up to 10×10 mm in size.
• Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.

• Combined eye-pieces and CCD camera mount
• 3x zoom and quick lens exchange
• Engraved guides on mmW platen
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Rock-solid mechanical design
• Submicron stage accuracy

• Die-to-die stepping time of under 100 ms
• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Even extreme variations in height, such as the case with warped wafers, can be compensated
• Interfaces to all major analysis instrumentation, optics software and testers
• Access to top side and bottom side of device under test (DUT)
• Highly accurate light measurement
• Test automation out-of-cassette for 24/7 operation

• Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
• Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
• Supports fully automated testing up to 10kV by eliminating arcing point
• Full wafer access via locking roll-out stage
• On-wafer power device characterization up to 10,000 V DC / 600 A
• Coaxial, triaxial, and pin jack feed-troughs available
• Convenient instrument connection kits
• Virtual Platen Lift and XY knobs at front
• Load/unload wafer to hot/cold chuck (-60° C to +300° C)
• Up to 15% faster transition times than other systems in the market

• Wafer temp verified <4.5 K (with 44 RF probes in contact) ​
• Magnetic field suppression to <200 nT
• Easy exchange of customizable probe cards
• Configurable for 150 mm, 200 mm and 300 mm wafers
• Options for fully automated wafer load or manual​
• Complete software suite for manual, semi-auto, or fully automated probing
• 25 wafer cassette capacity for fully automated testing
• ~15 minute cooldown time per wafer

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.