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FormFactor - Cascade WPH Probe - Multi-contact DC probe with full-radius needles
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
The WPH probes feature up to 12 ceramic-bladed, nickel-plated, tungsten needles with a 2 x 12 square pin cable interface. The circuit board has been laid out such that both series and shunt components can be added to the signal path of each needle.
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- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
- High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
- RF bandwidth to 500 MHz
- Long probe life: > 250,000 contacts
- Beryllium-copper tips for gold pads or tungsten for aluminum pads
- Oscillation-free testing of wide-bandwidth analog circuits
- Use with ACP series probes to provide functional at-speed testing for known-good-die
- Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
- Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
Next Generation Wafer Probing
- Continues the Infinity family’s Industry leading electrical performance
- High temperature capability (175° C +) for automotive device characterization and other applications
- Better tip visibility for enhanced placement accuracy and repeatability
- Improved tip life/durability with solid rhodium contacts
- New tip architecture enables support for narrower pitches (e.g. 25um)
- Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
- Accommodates a combination of up to four Cascade Microtech probes
- Configurable for mixed-signal RF/mmW testing
- Quick and easy repairs to be performed in the field, by simply replacing individual probes
- Adaptable to new device layouts by exchanging individual probes
Cryogenic Temperatures
- Fully isolated experiment space for true 4K temperatures during probing
- Cryogenic positioners to provide large travel ranges without warming up the device
- Integrated helium pot for high temperature stability of the device under test
- Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
- Rapid cool liquid nitrogen option for faster cool down times
See "Specifications & Details" tab for more key features
- Lithographic thin-film construction
- Excellent crosstalk characteristics
- Non-oxidizing nickel alloy tips
- Innovative force delivery mechanism
- 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
- GSG, SG, GS, GSGSG, GSSG, SGS configurations
- 50 to 250 µm pitches (other pitches available on request)
- High current version (2 A) available
Advantages
- Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
- Superior measurement accuracy and repeatability
- Small scrub minimizes damage to aluminum pad
- Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
- Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
