FormFactor - Cascade PLV50 - 150 mm manual vacuum probe system
Flexibility
- Different substrate carriers for wafers up to 150 mm or single dies
- Up to six positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Entry-level, manual wafer probing in a vacuum environment
The PLV50 is a highly-precise, cost-effective probe station for wafers and substrates up to 150 mm in a vacuum environment < 1×10-4 mbar. Specially designed for laboratory requirements, it supports a wide range of applications, including DC and RF measurements, MEMS and optoelectronic tests.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Stability
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
Ease of use
- Ergonomic and straightforward design
- Intuitive, manual operation
- Simple microscope operation
- Hinged topside lid
- Comfortable and easy operation
- Quick and ergonomic change of DUT
- Topside access to probes and samples
High measurement throughput
- Independent control of linear chuck stage and positioners
- Contact/separation stroke for probe platen
- Fast, manual step-and-repeat testing of the whole wafer
- Simultaneous contacting and separation of all probes
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More Product Information
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
- Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
- Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
- Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
- Durable probe structure ensures more than 250,000 contacts
- Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
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Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
- Designed for use with specific Probe Systems
- Tables to suit all facility requirements and applications
- Stable probing, even in submicron range
- Granite platen ensures rigidity and temperature stability
- Can be combined with the Shield Enclosures
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
