FormFactor - Cascade |Z| Probe® PCB - Robust RF test on PCB and ceramic
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
Flexibility is the key for efficient PCB and ceramic testing. The |Z| Probe® PCB is simple to align and handle and can be easily positioned. It optimally replaces costly test fixtures which are often inflexible. A robust design makes the |Z| Probe PCB easy to handle and offers a long working life typically more than one million (1,000,000) contacts.
The planar tip of the |Z| Probe PCB has precisely calculated, parallel, separate contact springs which move independently of one another, allowing a precise, quick and simple contact with the DUT, even if there are significant contact height differences. This unique feature as well as the overall very robust design of the |Z| Probe PCB ensures a long life and simple handling.
Used in conjunction with a manual probe system including probe positioners and calibration substrates, the |Z| Probe PCB becomes the ultimate tool for all RF circuit probing needs.
More Product Information
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Coaxial and triaxial measurements up to 10,000 V
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High-quality construction with low-noise electrical performance
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Replaceable probe tips in a variety of tip sizes
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Temperature range of -60°C to 300°C
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Triaxial measurement ensures a much better understanding of device leakage in the off state
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Highly reliable, stable and repeatable measurements
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Integrally designed as part of a complete measurement solution
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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