FormFactor - Cascade |Z| Probe® PCB - Robust RF test on PCB and ceramic
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
Flexibility is the key for efficient PCB and ceramic testing. The |Z| Probe® PCB is simple to align and handle and can be easily positioned. It optimally replaces costly test fixtures which are often inflexible. A robust design makes the |Z| Probe PCB easy to handle and offers a long working life typically more than one million (1,000,000) contacts.
The planar tip of the |Z| Probe PCB has precisely calculated, parallel, separate contact springs which move independently of one another, allowing a precise, quick and simple contact with the DUT, even if there are significant contact height differences. This unique feature as well as the overall very robust design of the |Z| Probe PCB ensures a long life and simple handling.
Used in conjunction with a manual probe system including probe positioners and calibration substrates, the |Z| Probe PCB becomes the ultimate tool for all RF circuit probing needs.
More Product Information

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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns

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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures

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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency

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Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
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Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
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LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
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Automatic load inductance compensation function ensures the most repeatable calibrations
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Easy to use Probe to ISS/CSR matching tool
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Additional remoting methods
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Interface with Velox™ over LAN

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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C

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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns

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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures

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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate

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Re-configurable for DC, RF, mmW, FA, WLR and more
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Thermal range: -60˚C to 300˚C available
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Upgrade path to meet your future needs
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Stable and repeatable measurements over a wide thermal range
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Advanced EMI-shielding with PureLine with AttoGuard technologies
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Best solution for low-noise and 1/f measurements
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Minimize AC and spectral noise
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Minimizes settling times for efficient measurements, without compromising accuracy over full thermal range
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Locking roll-out stage
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Innovative microscope remote control
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Intuitive ergonomic stage controls
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Quick, safe, and comfortable wafer access
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Easy on-wafer navigation
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Fast setup and test data gathering
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Dedicated Velox version for manual probe stations
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AugmentedAlign tool with on screen markers for improved RF measurement accuracy

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
