FormFactor - HPD IQ3000 - Fully automated cryogenic wafer probing at 4K
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Wafer temp verified <4.5 K (with 44 RF probes in contact)
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Magnetic field suppression to <200 nT
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Easy exchange of customizable probe cards
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Configurable for 150 mm, 200 mm and 300 mm wafers
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Options for fully automated wafer load or manual
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Complete software suite for manual, semi-auto, or fully automated probing
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25 wafer cassette capacity for fully automated testing
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~15 minute cooldown time per wafer
See more Key Features in Specifications & Details tab
The HPD IQ3000 is a high precision fully automated probe station for 150 mm, 200 mm or 300 mm substrates in a 4 K environment. To accelerate the realization of commercial quantum and superconducting computers, we provide chip developers with the tools they need to intelligently iterate on their designs.
The IQ3000 integrates configurable DC and RF cabling, with custom probe cards available for ultimate flexibility of test configurations. A robust design with integrated magnetic shielding provides the stable environmental conditions necessary to ensure the highest quality data for the most sensitive superconducting devices. Fully automated wafer loading and the sophisticated Velox™ software suite allows for high throughput testing and unattended operation for rapid time-to-data.
FormFactor’s longstanding probing expertise and decades of precision cryogenic experience come together in this system to take superconducting device test and measurement out of the lab into fab.
Applications: Quantum computing, superconducting chip development, quantum information science
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
Flexibility
- Easy exchange of customizable probe cards
- Configurable for 150 mm, 200 mm and 300 mm wafers
- Up to 56 RF coax (up to 18 GHz)
- Up to 520 DC lines
Automation
- Options for fully automated wafer load or manual
- Complete software suite for manual, semi-auto, or fully automated probing
Time to data
- 25 wafer cassette capacity for fully automated testing
- ~15 minute cooldown time per wafer
- High speed motion stages for quick die-to-die movement
- Rigid motion stack for fast settling time
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More Product Information
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
See more Key Featueres on Specfications & Details tab
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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