FormFactor - Cascade Positioners - DC, RF and optical probe positioning for highest accuracy measurements
DC, RF and Optical Probe Positioning for Highest Accuracy Measurements
FormFactor offers a wide variety of manual and motorized probe positioners for any application from DC to terahertz measurements and beyond.
Engineered for high stability and accuracy, FormFactor‘s positioners enable precise, backlash-free and repeatable probe tip placements – from simple IV/CV measurements to highly challenging measurement tasks.
Enhanced with FormFactor‘s High Temperature Stability (HTS), the positioners become part of our exclusive Contact Intelligence™ Technology that enables small pad probing over a full temperature range.
Unsurpassed accuracy and highest productivity is achieved with the revolutionary Autonomous Measurement Assistants for DC, RF and Silicon Photonics testing. These wafer probing assistants utilize our programmable positioners and enable fully autonomous, hands-free measurements – minimizing training needs and accelerating time to market.
Designed and validated with proven quality standards, our positioners are always the perfect match to your FormFactor probe station.
Application Flexibility
Probe Station Compatibility
MPS150 / EPS150 |
Summit |
PM8 / EPS200 |
CM300xi |
PA300 / PM300 |
Tesla |
Vac / Cryo |
|
---|---|---|---|---|---|---|---|
Manual Positioners |
|||||||
DPP105 |
O |
- |
O | X |
O |
X |
X |
DPP2xx |
O |
O |
O |
O |
O |
O |
X |
DPP3xx |
O |
- |
O |
- |
O |
- |
X |
DPP450 |
O |
- |
- |
- |
- |
X |
X |
VCP110 |
X |
X |
X |
X |
X |
X |
O |
RPP210 |
O |
O |
O |
O |
O |
O |
X |
RPP304 |
O |
O |
O |
O |
X |
X |
X |
RPP305 |
O |
- |
O |
O |
O |
X |
X |
RPP404 |
O |
O |
O |
O |
X |
X |
X |
rmmWLAP |
X |
O |
O |
O |
- |
- |
X |
Motorized Positioners |
|||||||
---|---|---|---|---|---|---|---|
RPP504 |
X |
O |
O |
O |
X |
X |
X |
PH510 |
X |
X |
O |
- |
O |
X |
X |
SiPh |
X |
O2 |
X |
O |
X |
X |
X |
O Recommended |
| - Possible (not recommended) | |
X Not Compatible |
1Summit2000 only |
||
2Summit200 only |
More Product Information

- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad

Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features

-
High power – 66 W at 2.4 GHz and 43 W at 5 GHz
-
Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
-
Excellent contact control and low contact resistance
-
High performance on any pad material (Al or Au)
-
Longest lifetime – typically one million (1,000,000) touchdowns

-
Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
-
Utilizes ACP tip design, GSG, GS or SG
-
RF tips available from DC to 110 GHz
-
Choice of BeCu or tungsten tips
-
DC power needles come standard with 100 pF microwave capacitor
-
Power bypass inductance: 8 nH
-
Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
-
Ideal for probing the entire circuit for functional test
-
Dual ACP configuration supports differential signaling applications
-
DC probes can provide power or slow logic to circuit under test

Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features

PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz

- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω

Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement





