FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
FormFactor’s Ultra-High-Power Probe (UHP), a high-voltage parametric probe, handles both high voltage (up to 10,000 V) and high current (up to 600 A) at a wide temperature range (-60ºC to 300ºC).
The high pulse current achieves full I-V characterization with one setup and one touchdown. Together with a TESLA on-wafer power device characterization system, the UHP fully utilizes the high-voltage/current capability of Keysight B1505A and N1265A Ultra High Current Expanders.
More Product Information
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- Ultra-stable GPS Disciplined Frequency Reference
- 10 Independent 10MHz outputs
- 1U chassis
- Meets MIL-STD-188-164A stability requirements
- Frequency accuracy to 1 x 10-12
- Dual Port NTP Server
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
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- Small, Light, and Low Power - Ideal for embedding into compact, hand-held and portable devices with a footprint of 27 mm x 27 mm x 14 mm, 20 gram weight and 2.2 W power consumption.
- Core Machine Vision Capabilities - Essential machine vision features including GPIO, triggering, and partial image modes.
- Exceptional Value - Get access to the latest global shutter CMOS sensors at low starting prices of just $199 USD.
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Power over Ethernet
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IEEE 1588 PTP
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Trigger over Ethernet
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Ultra-compact design
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Monochrome (G-158B) and color (G-158C) models
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GigE Vision interface with Power over Ethernet
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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IEEE 1588 Precision Time Protocol allows for easy synchronization of multiple cameras and devices on network
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Trigger over Ethernet Action Commands allow for a single cable solution to reduce system costs
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Comprehensive I/O functionality for simplified system integration
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads on top and bottom of housing or optional tripod adapter
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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Select between B 270 ASG protection glass and filter types: Jenofilt 217 IR cut filter, Hoya C-5000 IR cut filter, RG715 IR pass filter, or RG830 IR pass filter
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
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Pulse tube cryocooler for cryogen free 4K temperatures
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He-3 sorption cooler for high power intercept and launch stage for ADR
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Single stage ADR provides solid state cooling down to 25mK
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Sample stage mounting at both 300mK and 30mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Cryogen-free option available
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Flexible sample space
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Low noise, low vibration
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Long holding time
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Stable He-3 pot temperature
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
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FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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