FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
FormFactor’s Ultra-High-Power Probe (UHP), a high-voltage parametric probe, handles both high voltage (up to 10,000 V) and high current (up to 600 A) at a wide temperature range (-60ºC to 300ºC).
The high pulse current achieves full I-V characterization with one setup and one touchdown. Together with a TESLA on-wafer power device characterization system, the UHP fully utilizes the high-voltage/current capability of Keysight B1505A and N1265A Ultra High Current Expanders.
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More Product Information
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
Safran’s SEEING™ 130 Wide includes a unique medium focal length catadioptric optics, limited by diffraction only and with ultra-low distortion, offering perfect imaging over 35 mm full-frame image format. It is fitted with a 10megapixel sensor.
SEEING™ 130 Wide enables high Signal to Noise Ratio for multispectral (MS), hyperspectral (HS) and low light level imaging. SEEING™ 130 Wide includes a spectral filter with 23 bands covering Blue, Green, Red, Near InfraRed and Red Edge MS, for a broad spectral range between 475 and 900nm. SEEING™ 130 Wide has a large Field of View of 6.3° x 4.3° / 54 x 36 km2 from a 500km/310 miles orbit.
In addition to its a thermal design within a robust structure, SEEING™ 130 Wide has a low SWaP, saving launch and operational costs.
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
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Continues the Infinity family’s Industry leading electrical performance
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High temperature capability (175° C +) for automotive device characterization and other applications
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Better tip visibility for enhanced placement accuracy and repeatability
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Improved tip life/durability with solid rhodium contacts
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New tip architecture enables support for narrower pitches (e.g. 25um)
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Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
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Trigger over Ethernet
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Piecewise Linear HDR feature
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IEEE 1588 PTP
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Ultra-compact design
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Monochrome (G-030B) and color (G-030C) models
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GigE Vision interface with Power over Ethernet
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Comprehensive I/O functionality for simplified system integration
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Trigger over Ethernet Action Commands allow for a single cable solution to reduce system cost
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IEEE 1588 Precision Time Protocol allows for easy synchronization of multiple cameras and devices on network
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads on top and bottom of housing or optional tripod adapter
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
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Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
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Select between B 270 ASG protection glass and filter types: Jenofilt 217 IR cut filter, Hoya C-5000 IR cut filter, RG715 IR pass filter, or RG830 IR pass filter
See the Modular Concept for lens mount and optical filter options.
See the Customization and OEM Solutions webpage for additional options.
See the Customization and OEM Solutions webpage for additional options.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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