FormFactor - Cascade SUMMIT200 - Advanced 200 mm semi-/ fully-automated probe system
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
200 mm Probe Station for Collecting High-accuracy Measurement Data up to 5X Faster
The new Cascade SUMMIT200 advanced 200mm probe system, is essential for collecting high accuracy measurement data on single or volume wafers; as fast as possible.
Designed for R&D, device characterization/modelling or niche production applications, the SUMMIT200 probe station enables precision electrical measurements over temperature for ultra-low noise, DC, RF, mmW and THz applications, with semi-automatic and now fully-automatic operation, for fastest time to accurate data.
The next generation probe system supports PureLine™ technology to achieve one of the lowest noise levels available on the market. Patented AttoGuard® and MicroChamber® technologies significantly improve low-leakage and low-capacitance measurements. A new advanced 200 mm fast stage, cassette handling up to 50 wafers, high throughput test features, and wide temperature range of -60°C to 300°C, provides everything needed for the scientist, R&D and test engineer, or production operator to get their job done fast.
The SUMMIT200 probe station supports Contact Intelligence™ – a unique technology which enables autonomous semiconductor test. A powerful combination of innovative system design and state of the art image processing provides an operator-independent solution to achieve highly-reliable measurement data at any time and temperature.
With a wide range of applications, and upgrade paths to meet any future needs, the SUMMIT200 provides the most advanced 200 mm probe station platform for fast, high accuracy and high-volume measurements for existing and future devices and ICs.
*The SUMMIT200 platform is also available in different versions for measurement tasks that do not need the enhanced feature set as described above. Please refer to Data Sheet for details and options.
Applications
- Failure Analysis
- IV/CV
- MEMS
- RF/mmW/THz
- Silicon Photonics
Measurement Accuracy
- Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
- Minimize AC and spectral noise with effective shielding capability
- Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
- Shortest signal path test integration for accurate, thermally stable, and low-error data collection
Productivity
- Enables up to 5x faster time to accurate data
- Advanced 200 mm stage with increased test throughput
- High throughput UT/MT (Unattended Test over Multiple Temperatures) with VueTrack™ and High-Temperature Stability (HTS) technologies
- Automated wafer handling with optional loader
- Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
- eVue digital imaging system with enhanced optical visualization, fast set-up, and in-die and wafer navigation
- Powerful automation tools reduce total test time on wafers, singulated dies, and modules
Positioning Accuracy
- Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
- Precision sub-micron positioning and active thermal compensations with motorized positioners and VueTrack PRO
- Additional quick “hands on” wafer positioning with manual ergonomic controls
Flexibility and application-tailored solutions
- RF/microwave device characterization, 1/f, WLR, FA and design debug
- Seamless integration between Velox and analyzers/measurement software
- Complete solutions using probe positioners and probe cards
- Versatile microscope mount system for fine-structure and large-area probing
- Full thermal range of -60°C to +300°C
Thermal Measurements
- Wide range of extremly performant, reliable thermal chuck systems from ATT
- Flexibility from hot only to full thermal range of -60°C to +300°C
- Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
- Up to 15% faster transition times than other systems in the market
- Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
- Field-upgradeable: grows with your needs
Ease of use
- Comfortable and ergonomic operation
- Quick and comfortable manual wafer access via locking roll-out stage
- Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
- Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- Loader integration – Easy creation of workflows and receipts and no need for any additional software
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
See more Key Features on Specifications & Details tab
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
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Infinity Probe: best for Al (Si)
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ACP Probe: best for AU (III-Vs)
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|Z| Probe: robust solution (long lifetime)
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RF chuck ±3 μm surface planarity
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Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
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Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
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Automated calibration monitoring
See more Key Features on Specifications & Details tab
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
Impedance Standard Substrates (ISSs) supports all of your high-frequency probing applications. Using them ensures greater accuracy and better repeatability in on-wafer calibration of vector network analyzers. Our ISSs offer the proven accuracy of LRRM calibrations with automatic load inductance compensation.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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