FormFactor - HPD IQ2000 - Rapid Chip-Scale Prober
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
Quantum test engineers have limited throughput due to the time it takes to cooldown a device to the test temperature. Current methodologies used in cryogenic chip probing systems require as much as 24 hours to exchange the device under test, which includes warming up the cryogenic system, venting the system to atmospheric pressure, disassembling the vacuum shroud and radiation shields to access the chip, and then reverting the process to prepare for the next cooldown.
FormFactor’s HPD IQ2000 is a high throughput chip-scale prober for singulated die testing at 4 K or 2 K. The system’s load-lock design enables thermalization of the device under test from 300 K to 4 K in less than an hour – improving the device throughput by up to 10X compared to conventional chip probers.
By leveraging FormFactor’s long experience in advanced probe card technology, the IQ2000 enables a higher density electrical interface than has ever been possible in chip-scale probers. The increased number of pins on the device enables the test of more structures in a single cooldown.
With the IQ2000 rapid chip-scale prober, quantum hardware developers can quickly obtain data for process development statistics to intelligently iterate on chip designs.
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More Product Information
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Continues the Infinity family’s Industry leading electrical performance
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High temperature capability (175° C +) for automotive device characterization and other applications
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Better tip visibility for enhanced placement accuracy and repeatability
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Improved tip life/durability with solid rhodium contacts
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New tip architecture enables support for narrower pitches (e.g. 25um)
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Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
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Infinity Probe: best for Al (Si)
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ACP Probe: best for AU (III-Vs)
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|Z| Probe: robust solution (long lifetime)
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RF chuck ±3 μm surface planarity
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Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
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Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
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Automated calibration monitoring
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Impedance Standard Substrates (ISSs) supports all of your high-frequency probing applications. Using them ensures greater accuracy and better repeatability in on-wafer calibration of vector network analyzers. Our ISSs offer the proven accuracy of LRRM calibrations with automatic load inductance compensation.
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Quick and easy probe tip navigation
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Z drive can work in the same range as the chuck
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Enables higher separation gap while the DUT stays in focus
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Automatically configure and optimize performance
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24/7 operating
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Increased MTBF
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Protects the measurement setup
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Prevents involuntary mechanical contact between lens and probes
See more Key Features in Specifications & Features tab
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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
See more Key Features on Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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