FormFactor - Cascade DCP 100 Series Probe - Delivers superior guarding and shielding
- High-quality construction with low-noise electrical performance
- Kelvin version for convenient 4-point measurements
- Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
- SSMC 50 connectors
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
The DCP100 delivers the measurement accuracy needed for advanced on-wafer process, device characterization and reliability testing. With superior guarding and shielding, these probes overcome the performance limitations of non-coaxial needle probes. They are integrally designed as part of a complete measurement solution, these probes are highly reliable, stable and repeatable.
Advantages
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
- Full electrical guard to the probe tip
- Integrally designed as part of Cascade’s complete measurement solution
- Highly reliable, stable and repeatable
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More Product Information
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
OptoVue
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
Horizontal Die-Level Edge Coupling
- Highest accuracy in test results
- Lowest coupling loss
- Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
- Reduced risk of damaging fibers with collision avoidance technology
- Ease of use for less experienced users
- Enables close simulation of real-world conditions with device performance closest to the final application
See "Specifications & Details" tab for more key features
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
SlimVue Microscope
- Combined eye-pieces and CCD camera mount
- 3x zoom and quick lens exchange
- Quick lens exchange
- 1 um optical resolution
- Minimized scope footprint
- Fast change from navigation optics to high-resolution optics
- Resolving ‹ 50 μm pads
- Simple integration with any mmW modules
Application Specific Sigma Kits
- Engraved guides on mmW platen
- Supports broadband, load pull, coax RF and banded waveguide configuration
- Optical feedback on platen position (gauge)
- Adaptable to any mmW/sub-THz applications
- Seamless integration with any mmW modules and tuners
- Fast mounting and setup change
THz measurement capability
- Rock-solid mechanical design
- Submicron stage accuracy
- Optical feedback on platen and probe position (gauge)
- Motorized positioner
- <+-1 um separation repeatability
- Micrometer-accurate and repeatable probe placement and overtravel
- Highly-precise and stable THz measurements
Measurement Accuracy
- Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
- Minimize AC and spectral noise with effective shielding capability
- Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
- Shortest signal path test integration for accurate, thermally stable, and low-error data collection
See "Specifications & Details" tab for more key features
- Ideal for multiport RF/Microwave and high-speed digital signal testing
- Mix DC and RF/Microwave signals on one probe
- Long lifetime – typically over one million (1,000,000) touchdowns
- Excellent performance in temperatures ranging from 10 K to 200°C
- Probe on any pad material with no damage
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
