Flexibility

• Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
• Temperatures range from -60°C to +300°C
• Surfaces are nickel or gold-plated
• Hybrid chuck design – operation with and without cooling unit
• Field-upgradeable: On-site cold upgrades for all main prober platforms

Highest Efficiency for Reduced Cost of Test

• Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
• Up to 15% faster transition times than other systems on the market

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC
• Can help to stabilize oscillations in high-gain devices
• Impedance match to low dynamic resistance laser diodes
• Custom configured for your application

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z0: 50 Ω

More than a calibration tool

• Calibration
• Validation
• Measurement
• Analysis

No one supports more VNA’s

• Support of more than 24 of the most common VNA’s

Tool for the novice

• Guided wizards and multimedia tutorials integrated
• Intelligence in setups

See "Specifications & Details" tab for more key features

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Accessories available, such as black bodies and optical motion analysis tools
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features