• Proven technology: designed in conjunction with several top STM groups in the world 
• Quiet, low vibration operation 
• Low running costs and reduced maintenance 
• Easy operation and fast cool-down; load sample when the system is cold for TL models 
• Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate

• Wafer temp verified <4.5 K (with 44 RF probes in contact) ​
• Magnetic field suppression to <200 nT
• Easy exchange of customizable probe cards
• Configurable for 150 mm, 200 mm and 300 mm wafers
• Options for fully automated wafer load or manual​
• Complete software suite for manual, semi-auto, or fully automated probing
• 25 wafer cassette capacity for fully automated testing
• ~15 minute cooldown time per wafer

• Low running costs, less vibration, less noise, reduced maintenance
• Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
• CMN calibrated thermometry on MC plate
• Operation via touch panel controller: Remote operation via ethernet interface

• Fully isolated experiment space for true 4K temperatures during probing
• Cryogenic positioners to provide large travel ranges without warming up the device
• Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
• A soft vacuum bellows provides a compliant mounting interface for the cryocooler
• Quick release vacuum feedthroughs for easy configurability
• A large rectangular port for high signal capacity

• High power – 66 W at 2.4 GHz and 43 W at 5 GHz
• Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
• Excellent contact control and low contact resistance
• High performance on any pad material (Al or Au)
• Longest lifetime – typically one million (1,000,000) touchdowns

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Revolutionary technology advancement for wafer and die-level photonics probing
• Highest accuracy in test results
• New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
• Minimized coupling losses with minimal trench dimensions
• Industry standard for vertical coupling to wafer-level grating couplers
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Dark, shielded and frost-free
• -40°C to +125°C
• Leveraging considerable expertise through an innovative engineering team
• Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
• Exclusive FormFactor-developed automated test methodology
• Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
• FormFactor-developed graphical user interface to manually control the optical positioning system
• Configurable between single fibers, fiber arrays and edge coupling holders

• Probe station
• Keysight Streamline Vector Network Analyzer (option up to 53 GHz)
• Choice of probes
• Known measurement accuracy traced back to independent standards
• Uses best measurement practices for optimized measurements
• Best in class RF and Microwave performance
• Small benchtop footprint