Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Accessories available, such as black bodies and optical motion analysis tools
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC
• Can help to stabilize oscillations in high-gain devices
• Impedance match to low dynamic resistance laser diodes
• Custom configured for your application

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

Gold-plated TESLA High-power MicroVac™ Chucks

• Prevent thin wafers from curling and breaking
• Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements

• Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
• Online design configuration tool helps you to specify your probe in minutes
• All designs are fully quadrant compatible
• Full solution includes probes, calibration substrates, stations, accessories and software
• Scalable architecture for future needs

Superior Mechanics

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Excellent measurement accuracy and repeatability
• Fast navigation and high-precision probe positioning

See "Specifications & Details" tab for more key features