• Low running costs, less vibration, less noise, reduced maintenance
• Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
• CMN calibrated thermometry on MC plate
• Operation via touch panel controller: Remote operation via ethernet interface

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Intuitive, manual drives
• Front loading capability through load door
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z₀: 50 Ω

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
• Prevent thin wafers from curling and breaking
• Safety interlock system with clear enclosure for operator safety during device measurements
• Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
• Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
• Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures

• Die-to-die stepping time of under 100 ms
• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Even extreme variations in height, such as the case with warped wafers, can be compensated
• Interfaces to all major analysis instrumentation, optics software and testers
• Access to top side and bottom side of device under test (DUT)
• Highly accurate light measurement
• Test automation out-of-cassette for 24/7 operation

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.