Frequency Range: 10 kHz - 30 MHz Conducted 5 MHz - 1GHz Radiated Frequency step: 10/500 kHz switchable CE 5/10 MHz switchable RE Includes: Generator, antenna, charger, wood case

1 - 6 GHz, 40dB Gain, 2.5dB N.F. Compensation long cable loss for EMI Measurement Improve system noise floor flatness High EMI performance High linearity LNA for EMI measurement High dynamic range Unconditionally Stable State-of-the-Art Technology

Fluke 5075603,  FLK-II900 Sonic Industrial Imager Includes Hard Shell Carrying Case and Neck Strap

Best price per contact – typically over one million (1,000,000) touchdowns RF/Microwave signal is shielded and completely air isolated in the probe body Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C

Replace costly and inflexible test fixtures with easy-to-use probe tips Long lifetime – typically over 1,000,000 contacts GS/SG footprint up to 4 GHz and GSG up to 20 GHz High-power RF test: up to 30 Watts

High power – 66 W at 2.4 GHz and 43 W at 5 GHz Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz Excellent contact control and low contact resistance High performance on any pad material (Al or Au)

Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material DC to 110 GHz models available in single and dual line versions Low insertion and return loss with ultra-low-loss ( -L ) versions Excellent crosstalk characteristics

Functional temperature range of -263 to +150°C Stainless steel tip material for thermal decoupling Coaxial cable with TCE matched inner and outer conductors Consistent tip geometry even at cryogenic temperatures

Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request). Utilizes ACP tip design, GSG, GS or SG RF tips available from DC to 110 GHz Choice of BeCu or tungsten tips

Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Ease of use –  Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Revolutionary technology advancement for wafer and die-level photonics probing Real-time in-situ calibrations Singulated die testing True die-level edge coupling In-situ power measurements Advanced calibration technologies Enables autonomous measurements See "Specifications & Details" tab for more key features