Measurement Accuracy Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies Minimize AC and spectral noise with effective shielding capability Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal Shortest signal path test integration for accurate, thermally stable, and low-error data collection See "Specifications & Details" tab for more key features

T-Wave Waveguide Banded Probes Low insertion loss Low contact resistance 140 GHz – 1.1 THz versions Probe pitch as narrow as 25 μm Lithographically-defined probe tip Nickel contacts See "Specifications & Details" tab for more key features

High-voltage/current Probes On-wafer power device characterization up to 10,000 V DC / 600 A Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Gold-plated TESLA High-power MicroVac™ Chucks Prevent thin wafers from curling and breaking Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck Accurate Rds(on) measurement at high current Accurate UIS measurements at high temperature

Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown Even distribution of high current with innovative multi-fingertip design Compatible with TESLA 200/300 mm power device characterization system Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz Online design configuration tool helps you to specify your probe in minutes All designs are fully quadrant compatible Full solution includes probes, calibration substrates, stations, accessories and software Scalable architecture for future needs

Floating Action Buttons Easy and fast setup of camera views Go to Light and Image Settings of the selected camera view with only one mouse click Workflow Wizard Guided workflows for wafer setups, alignment tools and Autonomous Assistants Workflow wizard shows task-relevant settings and options only Wizard settings can be corrected anytime – no need to restart the wizard Wizard helps with intelligent solutions in case of error See "Specifications & Details" tab for more key features

Designed for use with specific Probe Systems Tables to suit all facility requirements and applications Stable probing, even in submicron range Granite platen ensures rigidity and temperature stability Can be combined with the Shield Enclosures

More than a calibration tool Calibration Validation Measurement Analysis No one supports more VNA’s Support of more than 24 of the most common VNA’s Tool for the novice Guided wizards and multimedia tutorials integrated Intelligence in setups See "Specifications & Details" tab for more key features

Full-radius, nickel-plated tungsten needles Power bypass inductance: 16 nH Supports collinear and non-standard needle configurations Support up to a maximum of 12 ceramic blades DC needles / contacts Ideal for probing the entire circuit for functional test DC probes can provide power or slow logic to circuit under test

Cryogenic Temperatures Fully isolated experiment space for true 4K temperatures during probing Cryogenic positioners to provide large travel ranges without warming up the device Integrated helium pot for high temperature stability of the device under test Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems Rapid cool liquid nitrogen option for faster cool down times See "Specifications & Details" tab for more key features

Environmental Control Wafer temp verified <4.5 K (with 44 RF probes in contact)  Magnetic field suppression to <200 nT​ Highly uniform wafer temperature Precise thermal stability and control Solid construction with granite base enables precision motion and vibration control See "Specifications & Details" tab for more key features