• Revolutionary technology advancement for wafer and die-level photonics probing
• Highest accuracy in test results
• New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
• Minimized coupling losses with minimal trench dimensions
• Industry standard for vertical coupling to wafer-level grating couplers
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Dark, shielded and frost-free
• -40°C to +125°C
• Leveraging considerable expertise through an innovative engineering team
• Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
• Exclusive FormFactor-developed automated test methodology
• Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
• FormFactor-developed graphical user interface to manually control the optical positioning system
• Configurable between single fibers, fiber arrays and edge coupling holders

• Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
• Temperatures range from -60°C to +300°C
• Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
• Low Thermal Resistance Technology
• MultiSense with multiple temperature sensors
• Isolated from ground
• Includes a jack for grounding and biasing
• Advanced wafer vacuum system for warped/partial thin wafers
• Provides uniform vacuum across the entire wafer surface
• Advanced shielding technology

• DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
• Full thermal range of -60°C to +300°C
• Reliable and repeatable contact
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• High thermal stability components
• On-axis probe-to-pad alignment
• Flexibility from hot only to full thermal range of -60°C to +300°C
• Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
• 3 performance level configurations (fully-shielded / shielded / open)
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
• User-centered design minimizes training costs and enhances efficiency

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Highest accuracy in test results
• Lowest coupling loss
• New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
• Minimized coupling losses with minimal trench dimensions
• Industry standard for vertical coupling to wafer-level grating couplers
• Dark, shielded and frost-free
• -40°C to +125°C
• Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
• Exclusive FormFactor-developed automated test methodology
• FormFactor-developed graphical user interface to manually control the optical positioning system
• Configurable between single fibers, fiber arrays and edge coupling holders

• Provides an effectively noise free environment around the device under test (DUT)
• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Up to 4x faster flicker noise thermal testing on 30 μm pads
• Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
• Provides fully managed and filtered AC power to the entire system – prober and instruments
• Filters harmful noise generated by external thermal control systems
• Reduced “antenna effect” injection of unwanted RF noise into the measurement path
• Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Enables full access to the chuck and the auxiliary sites
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• User-centered design minimizes training costs and enhances efficiency
• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test