FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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Products
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
See more Key Features on Specifications & Details tab
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Combined eye-pieces and CCD camera mount
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3x zoom and quick lens exchange
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Engraved guides on mmW platen
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Supports broadband, load pull, coax RF and banded waveguide configuration
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Rock-solid mechanical design
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Submicron stage accuracy
See more Key Features on Specifications & Details tab
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Infinity Probe: best for Al (Si)
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ACP Probe: best for AU (III-Vs)
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|Z| Probe: robust solution (long lifetime)
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RF chuck ±3 μm surface planarity
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Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
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Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
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Automated calibration monitoring
See more Key Features on Specifications & Details tab
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Quick and easy probe tip navigation
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Z drive can work in the same range as the chuck
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Enables higher separation gap while the DUT stays in focus
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Automatically configure and optimize performance
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24/7 operating
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Increased MTBF
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Protects the measurement setup
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Prevents involuntary mechanical contact between lens and probes
See more Key Features in Specifications & Features tab
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance