Superior field confinement reduces unwanted couplings to nearby devices and transmission modes Superior measurement accuracy and repeatability Small scrub minimizes damage to aluminum pad Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au

Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical Reduced unwanted couplings and transmission modes Able to shrink pad geometries to 25 x 35 µm (best case) Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au

Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results

Continues the Infinity family’s Industry leading electrical performance High temperature capability (175° C +) for automotive device characterization and other applications Better tip visibility for enhanced placement accuracy and repeatability

The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.

Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL Re-configurable and upgradable as requirements grow Minimizes setup times with no loss in performance or accuracy

Ideal for multiport RF/Microwave and high-speed digital signal testing Mix DC and RF/Microwave signals on one probe Long lifetime – typically over one million (1,000,000) touchdowns Excellent performance in temperatures ranging from 10 K to 200°C

Substrate material: High-resistivity silicon Substrate thickness: 275 µm Dielectric constant: 11.8 Nominal Z0: 50 Ω

Die-to-die stepping time of under 100 ms Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology Even extreme variations in height, such as the case with warped wafers, can be compensated

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Probe positioners placed inside vacuum chamber Short and stable probe arms

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Probe positioners placed inside vacuum chamber Short and stable probe arms