Best price per contact – typically over one million (1,000,000) touchdowns RF/Microwave signal is shielded and completely air isolated in the probe body Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C

Replace costly and inflexible test fixtures with easy-to-use probe tips Long lifetime – typically over 1,000,000 contacts GS/SG footprint up to 4 GHz and GSG up to 20 GHz High-power RF test: up to 30 Watts

High power – 66 W at 2.4 GHz and 43 W at 5 GHz Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz Excellent contact control and low contact resistance High performance on any pad material (Al or Au)

Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material DC to 110 GHz models available in single and dual line versions Low insertion and return loss with ultra-low-loss ( -L ) versions Excellent crosstalk characteristics

Functional temperature range of -263 to +150°C Stainless steel tip material for thermal decoupling Coaxial cable with TCE matched inner and outer conductors Consistent tip geometry even at cryogenic temperatures

Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request). Utilizes ACP tip design, GSG, GS or SG RF tips available from DC to 110 GHz Choice of BeCu or tungsten tips

Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Ease of use –  Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Revolutionary technology advancement for wafer and die-level photonics probing Highest accuracy in test results New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench

Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided Temperatures range from -60°C to +300°C

DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug Full thermal range of -60°C to +300°C Reliable and repeatable contact Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology

Revolutionary technology advancement for wafer and die-level photonics probing Real-time in-situ calibrations Highest accuracy in test results Lowest coupling loss