A New Definition of Speed 

The all new Linea HS™ delivers line rates up to an incredible 400 kHz at 32k resolution--over 13 Gpixels/sec via CLHS interface.

The Next Generation of Linescan Imaging is here 

Building on Teledyne DALSA’s heritage in CCD TDI, the new CMOS TDI technology in our Linea HS is the most advanced in the marketplace. With up to 128 TDI stages (plus an extra 64 in HDR mode) for unmatched sensitivity and incredibly low noise, Linea HS excels in the highest speed, lowest light applications. Available backside illuminated (BSI) models bring even more sensitivity, with significantly increased QE and response in near UV wavelengths.

Equipped for the Future 

The Linea HS brings your imaging system the speed and power of the PCIe Gen 3 platform when paired with Xtium2. 

Leveraging the high efficiency of the CameraLink HS interface's X-protocol, the Xtium2 CLHS PX8 supports Active Optical Cable (AOC) and industry standard CX4 cables with up to 7-CLHS lanes, each operating at 10.3 Gbits/s, to acquire images at up to 8.4 GBytes/s. 

The Xtium™2 CLHS FX8 builds in native fiber optic connectors, supporting up to four bidirectional SFP+ modules to deliver aggregate bandwidth of 4.8 GBytes/s, all in a compact, half-length, single slot solution. 

With slim, robust, and cost effective fiber optic cabling, Linea HS and Xtium2 allow cable lengths beyond 100 meters to enable the newest and most demanding vision applications.

Packed with powerful features 

The Linea HS cameras deliver the highest performance available, with unique features that significantly improve detectability for many demanding applications. 

• HDR Imaging 
• Sychronized IO to control external lighting from the camera 
• Multifield synchronization for simultaneous brightfield/darkfield imaging--up to four spectrally independent views in a single pass 
• Fiber optic cables up to 100 m 
• High MTF pixel design 
• Available BSI models with enhanced UV response 
• Super resolution mode 
• View our product tour for more!

Typical Applications 

The Linea HS enables high speed and high sensitivity imaging in light starved conditions like these: 

• FPD Inspection 
• PCB Inspection 
• Semiconductor Wafer Inspection 
• Gene Sequencing 
• Digital Pathology 

If you need maximum throughput in the toughest conditions, you need Linea HS.

Feature Highlight: Multifield 

Multifield is a new imaging technology that enables capturing multiple images using various lighting conditions (e.g. brightfield, darkfield, and backlight) in a single scan.

Teledyne DALSA’s Linea HS Multifield camera is the first product in the industry capable of capturing up to three images using light sources at different wavelengths. The camera uses advanced wafer-level coated dichroic filters with minimum spectral crosstalk to spectrally isolate three images captured by separate TDI arrays. Depending on the light sources used, narrowband filters may be needed at the light sources.

This new technology significantly improves inspection speeds and image quality, as it eliminates the need for multiple scans. The difference between traditional color imaging and multifield imaging is the filter technology. Conventional color filters have significant spectral crosstalk between RGB channels, while the multifield filters have minimum spectral crosstalk

Feature Highlight: Patent Pending Pixel Offset Technology 

The 32k camera uses two 16k/5 μm TDI arrays with ½ pixel offset. Two 16k/5μm image data are captured and then reconstructed to achieve a super resolution image of 32k/2.5 μm in real time. This significantly enhances detectability for subpixel defects. 

Another advantage of the pixel offset technology is that existing 16k/5μm lenses can be used without sacrifice in responsivity and MTF with a smaller physical pixel size.