Teledyne DALSA - Linea HS2 16k 1MHz BSI Camera Series
- 1 MHz max line rate
- 65dB dynamic range
- Onchip 2x binning
- Mono/HDR/HFW
- Multi-arrays TDI
- Dual CLHS CX4 AOC output
Drawing on Teledyne’s four decades of industry leading expertise, the all new Linea™ HS2 camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput.
Introducing The Future of Line Scan Imaging The industry’s First 16K 1MHz TDI Camera: Teledyne DALSA’s new Linea HS2 camera represents another breakthrough in next generation TDI technology. Designed for ultra high speed imaging in light starved condition, this camera offers superior image quality with 16k resolution at a max line rate 1MHz. It has dual CLHS data interface that achieves 16GB/s data throughput with field-proven reliability in high-speed data transmission.
Family Specifications
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Camera Type |
TDI Line Scan |
|---|---|
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Sensor Technology |
CMOS |
|
Supported Interfaces |
Camera Link HS |
|
Spectrum Capability |
roUltraviolet (350-400 nm), Visible (400-700 nm), Near Infrared (700-1000 nm) 1 |
Specifications
|
Highlighted |
|
|---|---|
|
Part Number |
H2-HM-16K100H-00-B |
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Resolution |
16384 x 288 (3 TDI arrays 128 + 128 + 32) |
|
Max Line Rate |
1000 kHz |
|
Pixel Size |
5 |
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Sensor Type |
CMOS |
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Shutter type |
N/A |
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Spectrum |
Mono |
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Lens Mount |
M90 x 1 mm |
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Synchronization |
Image sync: Free-running, external trigger, CLHS trigger |
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Data Interface |
Camera Link HS |
|
Protection |
IP30 |
|
Recommended System Configuration |
|
|---|---|
|
Port |
CLHS 7 Data Lanes (10.3 Gbps/lane) |
|
Compliance & Certifications |
|
|---|---|
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Compliance |
CE, FCC, KCC, RoHS. |
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Machine Vision Standard |
CameraLink HS v1.0 |
|
Warranty |
3 years |
|
Features |
|
|---|---|
|
Acquisition Modes |
Continuous |
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Exposure Control |
Hardware trigger, programmable via camera API |
|
Flash Memory |
Cameras |
|
Gain Control |
Manual |
|
Performance |
|
|---|---|
|
Dynamic Range dB |
65 |
|
Gain Range |
1x to 10x |
|
Peak Wavelength |
620 nm |
|
Responsivity |
700+700+175 (DN8/nJ/cm2) |
|
Physical |
|
|---|---|
|
Connector |
CX4 or Hirose 12-pin circular (male) |
|
Digitization Bit Depth (ADC) |
8-bit, 10-bit |
|
Dimensions [W x H x L] |
97 mm x 180 mm x 76.9 mm |
|
Mass |
1.48 kg |
|
Operating Temperature |
0°C to 50°C (measured at the front face of the camera) |
|
Power Consumption [Maximum] |
56 W |
|
Power Requirements |
24 V via GPIO connector |
|
Storage Humidity |
15 to 85% (no condensation) |
|
Storage Temperature |
-20°C to 80°C |
More Product Information
- Image acquisition from Camera Link Base camera
- Supports Camera Link® operations up to 85MHz
- Supports 32/64-bit Windows platforms
- Quarter-length PCI Express x1 Board
- Power Over Camera Link® (PoCL) Compliant
- Offers external acquisition control signals on single PCIe x1 slotROHS compliant
The Forge is based on an all-new camera platform designed to support a feature and sensor set to easily build robust and powerful systems faster. It offers flexible link speeds as well as the ability to go beyond 5GigE performance and control data transfer to the host. With OEMs in mind, the Forge provides features for easy integration, a seamless upgrade path from 1GigE systems and supports a choice of SDK’s and GigE Vision compliant software packages.
- 150 MHz, 2 analog channels
- 8 synchronized digital channels (T3AWG2152-D only)
- 16-bit vertical resolution
- 128 MPts @Ch waveform memory
- Max sampling rate of 600 MS/s
- High resolution global shutter CMOS sensor
- 3 resolution models – 2M, 3M and 5M
- Dual core 1.5 GHz processor
- Embedded application software
- Ease-to-use setup for new vision adopters
- Built-in vision capabilities for most applications
- Standard factory protocols (EthernetIP, Modbus, Profinet)
- Operator interface flexibility
- Gigabit Ethernet and RS232 communications
- Isolated I/O and direct lamp connections
- Integrated ring light (optional on 2M version only)
- IP67 enclosure with lens cap
- Convenient mounting options
- Standard M12 cables
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Full-radius, nickel-plated tungsten needles
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Power bypass inductance: 16 nH
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Supports collinear and non-standard needle configurations
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Support up to a maximum of 12 ceramic blades DC needles / contacts
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
- Near Linear Power Supply
- Modular
- ≥0.95 PFC
- Digital control loop technology
- High Power Density (3.5 watts/cubic inch)
- “Virtual Assets” by:
- Series operation
- Parallel operation
- Combined operation with loads
- Simple integration
- Small
- Complete, closed-loop system with embedded controls in less than 28 x 13.2 x 7.5 mm
- Precise
- 0.5 µm resolution
- 6 mm of travel
- Simple system integration
- High-level motion commands over standard serial interface (I2C or SPI)
- Flexible system, fast to market
- Rapidly configurable for push or pull motion
- Low voltage / low power use
- 3.3 V input, <500 mW power use
- Holds position when power is off
The Blackfly® S leverages the industry’s most advanced sensors in an ice-cube form factor. It is packed with powerful features enabling you to easily produce the exact images you need and accelerate your application development. This includes both automatic and precise manual control over image capture and on-camera pre-processing. On-camera features including IEEE1588 clock synchronization and full compatibility with popular third-party software supporting GigE Vision, gives system designers the tools to quickly develop innovative solutions. GigE models featuring Lossless Compression (LLC) are also available with higher maximum frame rates and lower bandwidth requirements, helping maximize output without compromising image quality. The Blackfly S is available in GigE, USB3, cased, and board-level versions.
The PPE6KV-A and HVP120 can handle up to 6000 Vpeak transient overvoltages and are designed for probing up to 2000 Vrms and 1000 Vrms respectively. Fast rise times, excellent frequency response, and a variety of standard accessories make these probes safe and ideal for high voltage measurement applications
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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