New Scale Technologies - M3-LS-U2-8 linear smart stage & developer kit
- Smart Stage: Embedded controller, no separate electronics
- Operate directly using I2C or SPI ASCII commands -or-
- Evaluate with Pathway™ PC Software and USB adapter
- Cost-effective, long-life: For high-volume production
- Small size: 32 x 32 x 10 mm
- High resolution: 0.5 μm with absolute encoding
- High speed: 35 mm/s
- Long stroke: 8 mm
- Power: 5 V DC input, ~ 3.2 W peak when moving
- High repeatability: (± 2 μm typical)
Precision, stability and ease of use for high volume product applications
The M3-LS-U2 Linear Smart Stage is a direct-drive, high precision micro stage built for fast, simple integration into miniature OEM systems. All drive and control functions are embedded into the compact stage assembly – no external electronics are needed!
The stage drive is a UTAF2 piezo motor combined with a 0.5 μm resolution sensor for precise, repeatable positioning of optics, probes, sensors and more. The piezo motor operates at 5 VDC. No high voltage boost is needed. Absolute encoding removes the need to home the stage on power-up, eliminating errors and disruptions in processes and experiments.
At 35 mm/sec it is 7x faster than other M3 Smart Stages.
The anodized aluminum stage uses linear ball bearing races with very low uniform friction. The bearings directly support the motor preload which creates a stable, precise and zero clearance guide system. The base is the maximum footprint required for installation in your product because the carriage moves within the total length of the base.
This smart stage is designed for long life and is ideal for embedding precision motion into high-volume products.
Digital Control and Pathway™ Software
The M3-LS-U2-8 Smart Stage can be driven directly via standard I2C or SPI serial protocols. The smart stage microprocessor accepts ASCII high-level motion instructions.
New Scale Pathway™ software and USB adapter enable PC control. Access all stage capabilities including settings, motion commands, performance diagnostics, and parameters stored in non-volatile memory. Use the intuitive script generator to create command sequences for automated operation.
Refer to "Datasheets & Downloads" for more specifications.
Applications
- DNA sequencing instruments
- Point-of-care diagnostic systems
- Portable spectroscopy instruments
- Biomedical probing & sampling
- Laser beam steering
- Miniature camera systems
- And much more
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M3-LS-U2-8 Specifications |
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Description |
High-speed Linear Smart Stage for high-volume applications: micro positioning stage with built-in controller |
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Travel Range (Stroke) |
8 mm |
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Dimensions |
32 x 32 x 10 mm including controller |
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Mass of Smart Stage (including controller) |
15 grams including controller (note 1) |
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Max Moving Mass (vertical) (note 2) |
5 grams payload mass recommended (note 3) |
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Max Moving Mass (sideways and horizontal) (note 2) |
20 grams payload mass recommended (note 3) |
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Force (operating) |
>= 0.3 N holding force >= 0.1 N bidirectional |
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Speed (at operating force) |
35 mm/s |
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Duty Cycle |
50% max recommended (note 8) |
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Resolution |
0.5 μm with absolute encoding |
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Bi-directional Repeatability |
± 5 μm |
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Accuracy |
± 10 μm |
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Input Power (note 4) |
5 VDC (4.75 V to 5.5 V) ~3.2 W peak at max speed and force ~0.35 W quiescent |
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Static Parallelism |
< 30 μm |
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Run-out |
< 10 μm |
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Pitch and Yaw |
< 1 mrad |
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Absolute Max Load |
see data sheet |
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Linear Slide Features |
Linear ball bearing races |
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Relative Humidity |
< 70% |
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Operating Temperature (note 5) |
-30 °C to +70 °C |
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Storage Temperature |
-40 °C to +80 °C |
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Lifetime |
50 km travel (Note 6) |
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Compliance |
RoHS / CE pending |
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Controller |
Embedded |
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Control Interface |
Directly via I2C or SPI serial interface Indirectly via USB adapter to PC |
Note 1: For the M3-LS-U2-8 smart stage, moving mass of the stage carriage without payload is ~6 grams
Note 2: Higher moving mass is possible but affects performance and lifetime
Note 3: For the M3-LS-U2-8 smart stage, torque due to gravity of the payload calculated from center point (see the coordinates in the data sheet PDF) on the carriage is recommended to be within 1.5 Nmm. Also recommend center of gravity of the payload above the carriage surface to be <=15 mm.
Note 4: Power depends on input voltage, speed and load
Note 5: Speed and force reduced at lower temperatures within the range
Note 6: Tested horizontally, with 20 grams load offset 8.75 mm at reverse position
Note 7: Corresponds to 10 million moves with an average random move of 120 µm. Lifetime depends on the application and use case. Please consult the factory to discuss your specific system design.
Note 8: A <50% duty cycle is recommended for operating at room temperature (25 °C or below) and mounting the stage on a surface with a good thermal conduction path to dissipate heat. Please consult NST for when operating at higher ambient temperatures.
More Product Information
Southwest Microwave’s high performance End Launch connectors are designed to provide low VSWR, mode free wideband response to 110 GHz for single-layer and multi-layer printed circuit boards where the high frequency signal is on the top layer. Available in SMA (27 GHz), 2.92 mm (K) (40 GHz), 2.40 mm (50 GHz), 1.85 mm (V) (67 GHz) and 1.0 mm (W) (110 GHz).
Male and female options along with narrow body and bulkhead feed-through. Unique clamping mechanism accommodates board thickness up to .300” (7.62 mm). Robust, reusable and repairable. Multiple launch configurations provide the best possible match to circuit layout. Works on microstrip and grounded coplanar waveguide (GCPW) designs. Signal-layer microstrip and GCPW test boards available. Soldering is optional.
Design Assistance:
- Printed circuit board layout and connector part number recommendation
- 3D models for mechanical layout
- HFSS models (version 18.0 or newer) for EM simulations upon request and availability
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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SOSA Aligned
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3U VPX Form Factor
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Low SWAP applications
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Ruggedization Level 200
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Provides low noise reference using Chip Scale Atomic Clock (CSAC)
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Optional SAASM GPS available with RS232 key-fill connectivity
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11 Radial Clock Outputs
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Programmable 3GHz outputs
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OpenVPX Backplane support for 1000BASE-KX, 10GBASE-KR, or PCIe
1.35 mm (E) DC to 90 GHz connectors from Southwest Microwave include a new Solderless Vertical launch connectors are designed for microstrip or grounded coplanar boards. They provide optimal signal integrity, are reusable and are installed without soldering. Suitable for various board materials and thickness.
The new Light Hub for Zebra Iris GTX Smart Cameras (HCS-150-ZEB) streamlines machine vision system setup. This innovative controller acts as a central hub, directly powering your Zebra Iris GTX Smart Camera while managing triggering and analog dimming control between the camera, compatible lights, and I/O accessories.
Equipped with Advanced Illumination’s SignaTech™ technology, the Light Hub delivers 4 amps of continuous output and up to 8 amps of overdrive strobe. This empowers you to choose from a vast array of Advanced Illumination lighting configurations, ensuring optimal illumination for your application. Whether you need seamless integration with an 3×3 infrared backlight or would like to overdrive strobe a 70″ high intensity bar light, the Light Hub delivers.
- All-in-one microstage - no separate controller
- Direct high-level command interface (I2C or SPI)
- USB adapter enables direct connection to PC
- Small: < 32x32x11 mm including controller
- Absolute encoding: high repeatability, no homing
- Low power: 6 VDC, ~5 W (only when moving)
- For integration into battery powered devices
- Long stroke: 15 mm
- High force: 1 N (~100g load vertical, ~200g horizontal)
- High stiffness with crossed roller bearing design
4U and 5U expansion chassis with ample power to run lots of PCIe slots and host multiple option cards. Provide total bidirectional throughtput between a host system and a target expansion system, delivering expanded I/O capabilities needed to support evolving workloads.
- Up to 18 Additional PCIe 3.0 Slots - Incorporate up to 18 additional PCIe 3.0 slots, allowing you to scale your system in response to your most complex application or program needs.
- System Design Flexibility - Connect host card to any system with a x16 slot. Easily add or remove I/O devices or make changes to existing components.
- Performance Optimization - Offload tasks from the host system and dedicate specific tasks to separate option cards, reducing congestion, latency, and resource contention.
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
With the complexity of modern aerospace systems and components, stringent safety standards, and rapidly emerging trends and technologies, the aerospace and defense industry is facing a time of expeditious change. These industry trends shape aerospace manufacturers’ testing needs, growth objectives, and overall business goals. The reality is that aging aerospace facilities aren’t prepared to keep up with these rapid trends. Organizations seeking a competitive edge in the industry aim to achieve sustainable practices and regulatory compliance or explore new avenues in electric Vertical Take-Off and Landing (eVTOL) aircraft and space exploration. This demands testing facilities that are future-proofed for innovative solutions.
New Scale Technologies (NST)
Embedded Motion Modules Make Great Products Smaller
Founded in 2002, NST develops, licenses and manufactures standard and customized embedded motion modules that fit on your fingertips. These include rotary and linear smart stages that incorporate our patented and proprietary technologies: SQUIGGLE® and UTAF piezoelectric ultrasonic motors, position sensors, precision bearings, drive and control circuits, and microprocessors with closed-loop firmware that connect to New Scale Pathway® PC software.
Our M3 micro mechatronic modules require only battery power and high-level digital commands to produce sub-micrometer precision movements. M3 smart stages are easy for customers to integrate into wearable, handheld, portable and battery-powered products to move very small optics, produce haptic feedback, and miniaturize complex instruments. For example, we use our M3 stages to create our multi-probe manipulator (MPM) system for electrophysiology.
New Scale Technologies uses ISO 9001:2015 and ISO 13485:2016 certified quality management systems.
Contact Details
New Scale Technologies Main Office
121 Victor Heights Parkway, Victor, NY 14564, USA
Phone: 585-924-4450
Email: nstsales@newscaletech.com
Imaging/Machine Vision
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